Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Carlos J. Sambucetti"'
Autor:
A. Domenicucci, Robert Rosenberg, Anthony K. Stamper, Xiaomeng Chen, Judith M. Rubino, Chao-Kun Hu, Eric G. Liniger, Lynne Gignac, Carlos J. Sambucetti
Publikováno v:
Microelectronic Engineering. 70:406-411
Electromigration in Cu interconnections with a 10-nm thick selective electroless CoWP coating on the top surface of Cu dual damascene lines has been investigated. The grain structures of the lines embedded in SiLK semiconductor dielectric ranged from
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77accc387dce5a2a4b2da4d20b8be252
https://doi.org/10.1016/s0167-9317(03)00286-7
https://doi.org/10.1016/s0167-9317(03)00286-7
Autor:
Milan Paunovic, K. W. Semkow, J. R. Marino, P. J. Bailey, Suryanarayana Kaja, Carlos J. Sambucetti, A. G. Schrott, Eugene J. O'Sullivan
Publikováno v:
IBM Journal of Research and Development. 42:607-620
Electrolessly deposited materials were investigated as possible diffusion barrier layers for multilayer microelectronic structures. Attention was focused on selective deposition of barrier layers on various surfaces, the barrier's capability to inhib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::920084dd2ff37628554d3720592d80fe
https://doi.org/10.1147/rd.425.0607
https://doi.org/10.1147/rd.425.0607
Publikováno v:
Journal of The Electrochemical Society. 142:1495-1500
The electroless deposition process was studied by statistical techniques. Two types of experiments were designed: the two-factor two-level factorial and the central composite rotatable five-factor five-level experiments. The two-factor factorial expe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04b34133f65fec990ae7f70f73d91fc5
https://doi.org/10.1149/1.2048603
https://doi.org/10.1149/1.2048603
Autor:
Lynne Gignac, Chao-Kun Hu, Carlos J. Sambucetti, Eric G. Liniger, Xiaomeng Chen, Robert Rosenberg, A. Domenicucci, Judith M. Rubino, Anthony K. Stamper
Publikováno v:
Applied Physics Letters. 81:1782-1784
Electromigration in on-chip Cu interconnections with a selective electroless metal coating, CoWP, CoSnP, or Pd, on the top surface of Cu damascene lines has been investigated. The 10–20 nm thick metal cap significantly improves electromigration lif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32f4296dab49e4ed3d669016cc354500
https://doi.org/10.1063/1.1504491
https://doi.org/10.1063/1.1504491
Publikováno v:
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).
A simple, selective and CMOS-compatible deposition method for nickel ceramic composite films has been demonstrated. Using an electroless plating technique, two types of nickel ceramic composite thin films, nickel-cordierite and nickel-iron (II, III)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f18985373f37466c32ad7303b2190874
https://doi.org/10.1109/memsys.2002.984283
https://doi.org/10.1109/memsys.2002.984283
Autor:
Carlos J. Sambucetti, Sung K. Kang, Madhav Datta, Keith T. Kwietniak, R.A. Carruthers, Peter A. Gruber, P. C. Andricacos, J.M.E. Harper, Leathen Shi, Guy Paul Brouillette, David Danovitch, J. Horkans, John M. Cotte
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
In addition to the environmental issue regarding the use of Pb-bearing solders in microelectronics applications, there is another issue associated with using Pb-bearing solders in interconnections, like flip chip solder interconnections in an advance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9d7ea7f2afe9d9296fc927f111865d8
https://doi.org/10.1109/ectc.1999.776186
https://doi.org/10.1109/ectc.1999.776186
Publikováno v:
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
A paste composed of thermoplastic binder, silver particles, and solvent is compounded for directly interconnecting a chip to a substrate. The thermoplastic nature of the binder has three distinct advantages: (i) the interconnection is fully reworkabl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a8ff7d09844bc796d509dfc8a666b5b
https://doi.org/10.1109/iemt.1995.541077
https://doi.org/10.1109/iemt.1995.541077
Autor:
Christopher V. Jahnes, Judith Marie Roldan, Ravi F. Saraf, Carlos J. Sambucetti, Jeffrey R. Marino, R. Jagannathan
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
In this paper, we report on the the rheological, electrical and mechanical properties of paste which is composed of a thermoplastic polymer, solvent and silver particles, and the resulting polymer/metal composite (PMC) which forms after the solvent f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f2028dc318038e62d1b7c2003d2571a
https://doi.org/10.1109/ectc.1995.517820
https://doi.org/10.1109/ectc.1995.517820
In the last leg of the project the major thrust has been on the assembly process using the conductive adhesive, viz., the optimization of the process conditions and the bonding equipment. The past at this point is deemed optimum in terms of the three
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7f34a3e9b4987ca689ccfb269c5a76a
https://doi.org/10.2172/555480
https://doi.org/10.2172/555480
In this report on Polymer/Metal Composite (PMC) adhesive the authors describe two aspects of the material that are crucial to its applicability as a viable material for Flip Chip Attach (FCA) technology. They describe the shelf-life of the material a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2da1a78127784e7aa57fcf3ee638fe8
https://doi.org/10.2172/226050
https://doi.org/10.2172/226050