Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Carla J Shute"'
Autor:
Shuyou Li, Y. Liao, J.R. Weertman, Benjamin D. Myers, Carla J Shute, Andrea M. Hodge, Yuntian Zhu, Troy W. Barbee
Publikováno v:
Scripta Materialia. 65:899-902
Copper disks containing columns of aligned nanotwins were subjected to high-pressure torsion (HPT) involving a half turn under a 3 GPa compressive stress. The overall shear strain of 21 at 1 mm from the center of rotation is concentrated at the surfa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e206692b17db4f41da8f0b58cb36f83
https://doi.org/10.1016/j.scriptamat.2011.08.004
https://doi.org/10.1016/j.scriptamat.2011.08.004
Autor:
Andrea M. Hodge, Troy W. Barbee, Shuyou Li, Benjamin D. Myers, J.R. Weertman, Carla J Shute, S. Xie
Publikováno v:
Acta Materialia. 59:4569-4577
High-purity Cu samples containing parallel columns of highly aligned nanotwins separated by coherent Σ3 twin boundaries (TBs) with median spacing of about 35 nm were subjected to tension–tension fatigue. It was found that the microstructure of hig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75c60b97af3db433709c33fb243fa75a
https://doi.org/10.1016/j.actamat.2011.04.002
https://doi.org/10.1016/j.actamat.2011.04.002
Publikováno v:
Scripta Materialia. 60:1073-1077
The response to cyclic deformation has been studied for Cu/Cu multilayer material consisting of columns of closely spaced, parallel nanotwins. The fatigue life under stress-controlled cycling is greatly improved over that of coarse-grained Cu. Nanotw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6dca5045250cdcbc4657ce252ecfd36
https://doi.org/10.1016/j.scriptamat.2008.11.049
https://doi.org/10.1016/j.scriptamat.2008.11.049
Autor:
Andrea M. Hodge, Y. Liao, Yuntian Zhu, Xiaoxu Huang, Timothy A. Furnish, Troy W. Barbee, J.R. Weertman, Chuanshi Hong, Carla J Shute
Publikováno v:
Hodge, A M, Furnish, T A, Shute, C J, Liao, Y, Huang, X, Hong, C, Zhu, Y T, Barbee Jr., T W & Weertman, J R 2012, ' Twin stability in highly nanotwinned Cu under compression, torsion and tension ', Scripta Materialia, vol. 66, no. 11, pp. 872-877 . https://doi.org/10.1016/j.scriptamat.2012.01.027
Twin stability under four distinct mechanical loading states has been investigated for highly nanotwinned Cu containing parallel nanotwins 40 nm thick. Observed deformation-induced microstructural changes under tension, compression, tension–tension
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::67780c9f3d583b3cb1bcb2814e11c45f
https://orbit.dtu.dk/en/publications/aefeac06-c15d-4cf5-85c1-c9e266b7586c
https://orbit.dtu.dk/en/publications/aefeac06-c15d-4cf5-85c1-c9e266b7586c
Autor:
J.R. Weertman, Edward D. Boyes, Mildred S. Dresselhaus, Kenta Yoshida, Carla J Shute, Michael R. Ward, Michael J. Walsh, Xiaoting Jia, Pratibha L. Gai
Publikováno v:
Microscopy research and technique. 74(7)
Structural and compositional studies of nanomaterials of technological importance have been carried out using advanced electron microscopy methods, including aberration-corrected transmission electron microscopy (AC-TEM), AC-high angle annular dark f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f9c33d5ecc918987633f316a8a989301
https://pubmed.ncbi.nlm.nih.gov/20954265
https://pubmed.ncbi.nlm.nih.gov/20954265
Autor:
Jerome B. Cohen, Carla J Shute
Publikováno v:
Materials Science and Engineering: A. 149:167-172
The activation energy residual stress relaxation in Al2wt.%Cu thin films on silicon was determined to be 0.87 eV by measuring the stress as a function of time in the temperature range 373–523 K. This value is approximately that for grain boundar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d49322959477b7eeb77705ae23be30d5
https://doi.org/10.1016/0921-5093(92)90377-d
https://doi.org/10.1016/0921-5093(92)90377-d
Autor:
Carla J Shute, Jerome B. Cohen
Publikováno v:
Journal of Applied Physics. 70:2104-2110
The strain gradient through the thickness of 0.5‐, 1.0‐, and 2.0‐mm‐thick Al‐2% Cu films on oxidized (001) Si wafers has been examined by using glancing‐angle x‐ray diffraction to measure the d spacing as a function of penetration depth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86c7c384c8e5a25c1075e05e2847f819
https://doi.org/10.1063/1.349446
https://doi.org/10.1063/1.349446
Autor:
J.B. Cohen, Carla J Shute
Publikováno v:
Journal of Materials Research. 6:950-956
The yield strength and interfacial bonding are properties of interest for understanding void formation in thin film interconnect and subsequent failure of VLSI devices. A method is presented to examine the mechanical properties of thin polycrystallin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aab52dce1c6b16157e1b6e961127077f
https://doi.org/10.1557/jmr.1991.0950
https://doi.org/10.1557/jmr.1991.0950
Publikováno v:
Microscopy and Microanalysis. 16:1566-1567
Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b0b7932725d2c378eba2aaa9333b649
https://doi.org/10.1017/s1431927610058344
https://doi.org/10.1017/s1431927610058344
Residual Stress Analysis of Al Alloy Thin Films by X-Ray Diffraction as a Function of Film Thickness
Publikováno v:
MRS Proceedings. 130
Residual stress has been measured as a function of layer thickness in thin films of an Al alloy on oxidized Si by the x-ray “d” versus sin2ψ technique. Samples with and without a passivation layer were examined. The results show an increase in r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::773164847162b47942acf9965a1621c5
https://doi.org/10.1557/proc-130-29
https://doi.org/10.1557/proc-130-29