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pro vyhledávání: '"Carl Lei"'
Autor:
Li-Cheng Shen, Chien-Wei Chien, Tao-Chih Chang, Tsung-Fu Yang, Wen-Chih Chen, Yin-Po Hung, Cheng-Ta Ko, Yuan-Chang Lee, Fang-Jun Leu, Ying-Ching Shih, Ingrid Wei, Carl Lei
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
By properly incorporating wafer level package (WLP) and chip embedded processes, a type II chip-in-substrate package (CiSP) without ultra-thin chips is developed for high speed memory devices in this paper. According to the design concept of the type
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c3b4e8176e4dd62e1f20fc83825b555
https://doi.org/10.1109/ectc.2007.373854
https://doi.org/10.1109/ectc.2007.373854
