Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Carl L. Dohrman"'
Publikováno v:
IEEE Microwave Magazine. 18:44-59
The Microsystems Technology Office of the U.S. Defense Advanced Research Projects Agency (DARPA) is developing revolutionary materials, devices, and integration techniques to meet the performance requirements for advanced microwave and millimeter-wav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15636cf3ed09ba62be91083a56690914
https://doi.org/10.1109/mmm.2016.2635811
https://doi.org/10.1109/mmm.2016.2635811
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 22:482-490
The Defense Advanced Research Projects Agency (DARPA) has developed programs in integrated photonics for over a decade. From the Electronic-photonic Integrated Circuits (EPIC) program to the more recent Electronic-photonic Heterogeneous Integration (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3dade555aec56bc08cbf060b972a68d
https://doi.org/10.1109/jstqe.2016.2577541
https://doi.org/10.1109/jstqe.2016.2577541
Publikováno v:
Journal of Lightwave Technology. 32:3428-3439
Over the past ten years, DARPA has made significant investments toward advancing the field of microwave photonics. This paper reviews DARPA-funded progress in this subject over the past decade. DARPA-funded research has advanced the state-of-the-art
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d3cdc0b39dab648bd2192a6ee3141b9
https://doi.org/10.1109/jlt.2014.2326395
https://doi.org/10.1109/jlt.2014.2326395
Publikováno v:
3DIC
The DARPA Microsystems Technology Office is developing revolutionary materials, devices, and integration techniques for meeting the performance requirements for advanced microwave and RF systems. The DARPA Compound Semiconductor Materials on Silicon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10b6ded0aacc05e82cfdd2eb7510d33d
https://doi.org/10.1109/3dic.2015.7334469
https://doi.org/10.1109/3dic.2015.7334469
Publikováno v:
Semiconductor Science and Technology. 22:29-34
Monolithic CMOS compatible AlGaInP visible LED arrays have been demonstrated on a novel platform called silicon on lattice-engineered substrate (SOLES). SOLES wafers are based on Si1−xGex virtual substrate technology and are suitable for the practi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1efb50863e22cc856636eda6f96a92af
https://doi.org/10.1088/0268-1242/22/2/006
https://doi.org/10.1088/0268-1242/22/2/006
Publikováno v:
ECS Transactions. 3:561-568
We review past and present work regarding epitaxial growth of GaAs on Ge surfaces. Early work in molecular beam epitaxy showed that substrate off-cut was a critical factor, although later work with gas-source molecular beam epitaxy and chemical vapor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9714d4a1ebbef72bf1eac3253bca81f
https://doi.org/10.1149/1.2355853
https://doi.org/10.1149/1.2355853
Microwave photonic components and systems are of significant interest to radar and communications systems used on military platforms. This paper highlights recent experimental results and system architectures aimed at moving microwave photonic compon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fc5c0c65ae58596402c532fe9f8a9896
https://zenodo.org/record/1276119
https://zenodo.org/record/1276119
Publikováno v:
2012 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
The DARPA Diverse Accessible Heterogeneous Integration (DAHI) program is developing transistor-scale heterogeneous integration processes to intimately combine advanced compound semiconductor (CS) devices, as well as other emerging materials and devic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1035929afac4620a4cd91fc6abc6363b
https://doi.org/10.1109/rfit.2012.6401596
https://doi.org/10.1109/rfit.2012.6401596
Publikováno v:
2012 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).
The DARPA Diverse Accessible Heterogeneous Integration (DAHI) program is developing transistor-scale heterogeneous integration processes to intimately combine advanced compound semiconductor (CS) devices, as well as other emerging materials and devic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ab637326934700fde9c39c400fc8554
https://doi.org/10.1109/bctm.2012.6352654
https://doi.org/10.1109/bctm.2012.6352654