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of 9
pro vyhledávání: '"Carl B. Miller"'
Autor:
Keng H. Leong, James F. Golden, Boyd V. Hunter, Robert D. Glesias, Carl B. Miller, Patrick J. Laverty
Publikováno v:
Journal of Laser Applications. 8:307-316
Fiber‐optic beam delivery is commonly used in industrial laser systems. This article examines the conditions for the optimal propagation of high power beams through optical fibers. Beam quality effects by step and gradient index fibers of different
Autor:
Patrick J. Laverty, Robert D. Glesias, Keng H. Leong, Carl B. Miller, Craig Marley, James F. Golden, Paul G. Sanders, Boyd V. Hunter
Publikováno v:
SPIE Proceedings.
One of the advantages offered by visible and NIR lasers over CO and CO{sub 2} lasers is that they can be delivered through optical fibers. Fiber-optic beam delivery is ideal when the beam must be delivered along a complex path or processing requires
Autor:
Robert D. Glesias, Carl B. Miller, Boyd V. Hunter, Keng H. Leong, James F. Golden, Patrick J. Laverty
Publikováno v:
International Congress on Applications of Lasers & Electro-Optics.
Multimode optical fibers enable efficient flexible laser beam delivery but at a loss in the quality of the delivered beam. The fiber-optic beam delivery system effectiveness is strengthened by the optimal selection of its components not only for mini
Conference
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Publikováno v:
Laser Focus World. Dec95 Buyers Guide '96, Vol. 31 Issue 12, p682. 159p.
Publikováno v:
Journal of Education for Business. Oct1942, Vol. 18 Issue 2, p29-29. 1p.
Autor:
Virgil L. Burton, lll
Wards now lists more than 112, 000 companies, 90% of which are private. Volumes 1, 2 and 3 provide current company information in a single A-Z arrangement. Volume 4 is a geographic company listing, offering at-a-glance evaluations of industry activit
Autor:
Jennie Hwang
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components
Autor:
Jennie S. Hwang
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components