Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Carine Besset"'
Autor:
Matteo Tremolada, Olivier Kermarrec, Mark Andrew Shaw, Xueren Zhang, Fabio Pietro Fiabane, Roberto Curti, Massimo Fere, Livio Gobbato, Carine Besset
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Recent progress made in Silicon Photonics building blocks has paved the way for large scale industrialisation of devices that can be fabricated in existing CMOS fabs, and recently important steps have also been taken on the industrialisation on 12″
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af68c8cb46287a27a29b80c55cda1f75
https://doi.org/10.1109/eptc.2016.7861446
https://doi.org/10.1109/eptc.2016.7861446
Autor:
Yann Henrion, Sandrine Lhostis, Stephane Moreau, Daniel Scevola, V. Balan, Francois Guyader, Carine Besset, David Bouchu, Anne-Lise Le Berrigo, E. Deloffre, A. Jouve, Julien Pruvost, Sebastien Mermoz
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa087c1878e6f6f7fe0a5107ac309479
https://doi.org/10.1109/ectc.2016.27
https://doi.org/10.1109/ectc.2016.27