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pro vyhledávání: '"Capela, Pauline"'
Autor:
Soares, Delfim, Ribeiro, Pedro E., Capela, Pauline, Barros, Daniel A., Cerqueira, M. F., Teixeira, S. F. C. F., Macedo, Francisco, Teixeira, J. Carlos
During the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::de308fec824d7bec3fcf3d108449d4eb
https://hdl.handle.net/1822/72028
https://hdl.handle.net/1822/72028
