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pro vyhledávání: '"Caparas, Jose Alvin"'
Autor:
Masuda Seiya, Kotaro Okabe, Won Kyoung Choi, Caparas Jose Alvin, Kazuto Shimada, Mitsuru Sawano, Yu Iwai
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The wafer thinning process and making backside redistribution layer (RDL) process were key technologies for assembling 2.5D and 3D IC the low profile device manufacturing. It was widely studied about temporary bonding material (TBM) for those advance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::baa4b532d89ab8e7de96ca1a78e330b1
https://doi.org/10.1109/eptc.2018.8654357
https://doi.org/10.1109/eptc.2018.8654357
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2015, p96-100, 5p
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p1250-1254, 5p