Zobrazeno 1 - 10
of 285
pro vyhledávání: '"Cao, Shun"'
Autor:
Sayama, Hiroki, Cao, Shun
This paper reports a case study of an application of high-resolution agent-based modeling and simulation to pandemic response planning on a university campus. In the summer of 2020, we were tasked with a COVID-19 pandemic response project to create a
Externí odkaz:
http://arxiv.org/abs/2405.11414
Autor:
Liao, Wenbo1,2,3 (AUTHOR) caoshun_0@163.com, Cao, Shun1,2,3 (AUTHOR) jiangyingjuly@163.com, Jiang, Ying1,4 (AUTHOR) somitsu@126.com, Shao, Weijie1,2,3 (AUTHOR) lizhao_688@163.com, Zhao, Li1,3 (AUTHOR), Yan, Chengzhi1,2,3 (AUTHOR) liaobo_0_0@126.com
Publikováno v:
Animals (2076-2615). Aug2024, Vol. 14 Issue 16, p2300. 15p.
Autor:
Cao, Shun1 (AUTHOR) scao7@central.uh.edu
Publikováno v:
Scientific Reports. 4/26/2024, Vol. 14 Issue 1, p1-14. 14p.
Publikováno v:
In Electrochemistry Communications November 2024 168
An ultrabroad absorber based on double-ring-shaped titanium nitride (TiN) nanoresonators, which can work in high temperatures, is proposed and numerically studied. The absorber with some optimal parameters exhibits an averaged absorption of 94.6% in
Externí odkaz:
http://arxiv.org/abs/2010.01254
A patterned structure of monolithic hexagonal boron nitride (hBN) on a glass substrate, which can enhance the emission of the embedded single photon emitters (SPEs), is useful for onchip single-photon sources of high-quality. Here, we design and demo
Externí odkaz:
http://arxiv.org/abs/2009.01479
Autor:
Cao, Shun, Sayama, Hiroki
Many temporal networks exhibit multiple system states, such as weekday and weekend patterns in social contact networks. The detection of such distinct states in temporal network data has recently been explored as it helps reveal underlying dynamical
Externí odkaz:
http://arxiv.org/abs/2007.12756
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the following
Externí odkaz:
http://arxiv.org/abs/2002.07807
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste with some fluid properties could slump and the unbalance between differen
Externí odkaz:
http://arxiv.org/abs/2002.01527
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fluid dynamic behaviour of molten solder paste. This capability is criti
Externí odkaz:
http://arxiv.org/abs/2001.09619