Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Camsari KY"'
Publikováno v:
Physical Review Applied, vol 12, iss 3
The growing field of quantum computing is based on the concept of a q-bit, which is a delicate superposition of 0 and 1, requiring cryogenic temperatures for its physical realization along with challenging coherent coupling techniques for entangling
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______325::36ed70ea4f3996648e5540e99342b1c0
https://escholarship.org/uc/item/25z842hd
https://escholarship.org/uc/item/25z842hd
Autor:
Nikhar S; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA., Kannan S; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA., Aadit NA; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA., Chowdhury S; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA., Camsari KY; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, 93106, USA. camsari@ece.ucsb.edu.
Publikováno v:
Nature communications [Nat Commun] 2024 Oct 17; Vol. 15 (1), pp. 8977. Date of Electronic Publication: 2024 Oct 17.
Autor:
Singh NS; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Kobayashi K; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA.; Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; Graduate School of Engineering, Tohoku University, 6-6 Aramaki Aza Aoba, Aoba-ku, Sendai, 980-0845, Japan., Cao Q; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Selcuk K; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Hu T; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Niazi S; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Aadit NA; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA., Kanai S; Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; Graduate School of Engineering, Tohoku University, 6-6 Aramaki Aza Aoba, Aoba-ku, Sendai, 980-0845, Japan.; WPI Advanced Institute for Materials Research (WPI-AIMR), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; Center for Science and Innovation in Spintronics (CSIS), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; PRESTO, Japan Science and Technology Agency (JST), Kawaguchi, 332-0012, Japan.; Division for the Establishment of Frontier Sciences of Organization for Advanced Studies at Tohoku University, Tohoku University, Sendai, 980-8577, Japan.; National Institutes for Quantum Science and Technology, Takasaki, 370-1207, Japan., Ohno H; Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; WPI Advanced Institute for Materials Research (WPI-AIMR), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; Center for Science and Innovation in Spintronics (CSIS), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan.; Center for Innovative Integrated Electronic Systems (CIES), Tohoku University, 468-1 Aramaki Aza Aoba, Aoba-ku, Sendai, 980-0845, Japan., Fukami S; Research Institute of Electrical Communication, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan. s-fukami@riec.tohoku.ac.jp.; Graduate School of Engineering, Tohoku University, 6-6 Aramaki Aza Aoba, Aoba-ku, Sendai, 980-0845, Japan. s-fukami@riec.tohoku.ac.jp.; WPI Advanced Institute for Materials Research (WPI-AIMR), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Science and Innovation in Spintronics (CSIS), Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Innovative Integrated Electronic Systems (CIES), Tohoku University, 468-1 Aramaki Aza Aoba, Aoba-ku, Sendai, 980-0845, Japan. s-fukami@riec.tohoku.ac.jp.; Inamori Research Institute of Science (InaRIS), Kyoto, 600-8411, Japan. s-fukami@riec.tohoku.ac.jp., Camsari KY; Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, 93106, CA, USA. camsari@ece.ucsb.edu.
Publikováno v:
Nature communications [Nat Commun] 2024 Mar 27; Vol. 15 (1), pp. 2685. Date of Electronic Publication: 2024 Mar 27.
Autor:
Park TJ; School of Materials Engineering, Purdue University, West Lafayette, Indiana47907, United States., Selcuk K; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, California93106, United States., Zhang HT; School of Materials Engineering, Purdue University, West Lafayette, Indiana47907, United States., Manna S; Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois60439, United States.; Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, Illinois60607, United States., Batra R; Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois60439, United States., Wang Q; School of Materials Engineering, Purdue University, West Lafayette, Indiana47907, United States., Yu H; School of Materials Engineering, Purdue University, West Lafayette, Indiana47907, United States., Aadit NA; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, California93106, United States., Sankaranarayanan SKRS; Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois60439, United States.; Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, Illinois60607, United States., Zhou H; X-ray Science Division, Advanced Photon Source, Argonne National Laboratory, Lemont, Illinois60439, United States., Camsari KY; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, California93106, United States., Ramanathan S; School of Materials Engineering, Purdue University, West Lafayette, Indiana47907, United States.
Publikováno v:
Nano letters [Nano Lett] 2022 Nov 09; Vol. 22 (21), pp. 8654-8661. Date of Electronic Publication: 2022 Oct 31.
Autor:
Faria R; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States., Kaiser J; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States., Camsari KY; Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, United States., Datta S; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States.
Publikováno v:
Frontiers in computational neuroscience [Front Comput Neurosci] 2021 Mar 08; Vol. 15, pp. 584797. Date of Electronic Publication: 2021 Mar 08 (Print Publication: 2021).
Autor:
Shen T; Department of Physics and Astronomy, Purdue University, West Lafayette, IN, 47907, USA. shen168@purdue.edu.; Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA. shen168@purdue.edu., Ostwal V; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, 47907, USA. vostwal@purdue.edu.; Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA. vostwal@purdue.edu., Camsari KY; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, 47907, USA., Appenzeller J; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, 47907, USA.; Birck Nanotechnology Center, Purdue University, West Lafayette, IN, 47907, USA.
Publikováno v:
Scientific reports [Sci Rep] 2020 Jul 01; Vol. 10 (1), pp. 10791. Date of Electronic Publication: 2020 Jul 01.
Autor:
Kaiser J; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States., Faria R; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States., Camsari KY; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States., Datta S; Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, United States.
Publikováno v:
Frontiers in computational neuroscience [Front Comput Neurosci] 2020 Feb 25; Vol. 14, pp. 14. Date of Electronic Publication: 2020 Feb 25 (Print Publication: 2020).
Autor:
Grollier J; Unité Mixte de Physique CNRS, Thales, Univ. Paris-Sud, Université Paris-Saclay, 91767 Palaiseau, France., Querlioz D; Centre de Nanosciences et de Nanotechnologies, Univ. Paris-Sud, CNRS, Université Paris-Saclay, 91405 Orsay, France., Camsari KY; School of Electrical & Computer Engineering, Purdue University, West Lafayette, Indiana 47907 USA., Everschor-Sitte K; Institute of Physics, Johannes Gutenberg University Mainz, D-55099 Mainz, Germany., Fukami S; Research Institute of Electrical Communication, Tohoku University, Sendai, Miyagi 9808577, Japan., Stiles MD; National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA.
Publikováno v:
Nature electronics [Nat Electron] 2020; Vol. 3 (7).
Autor:
Borders WA; Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan., Pervaiz AZ; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA., Fukami S; Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Innovative Integrated Electronic Systems, Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Spintronics Research Network, Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp.; Center for Science and Innovation in Spintronics (Core Research Cluster), Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp.; WPI-Advanced Institute for Materials Research, Tohoku University, Sendai, Japan. s-fukami@riec.tohoku.ac.jp., Camsari KY; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA. kcamsari@purdue.edu., Ohno H; Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University, Sendai, Japan.; Center for Spintronics Integrated Systems, Tohoku University, Sendai, Japan.; Center for Innovative Integrated Electronic Systems, Tohoku University, Sendai, Japan.; Center for Spintronics Research Network, Tohoku University, Sendai, Japan.; Center for Science and Innovation in Spintronics (Core Research Cluster), Tohoku University, Sendai, Japan.; WPI-Advanced Institute for Materials Research, Tohoku University, Sendai, Japan., Datta S; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA.
Publikováno v:
Nature [Nature] 2019 Sep; Vol. 573 (7774), pp. 390-393. Date of Electronic Publication: 2019 Sep 18.
Publikováno v:
IEEE transactions on neural networks and learning systems [IEEE Trans Neural Netw Learn Syst] 2019 Jun; Vol. 30 (6), pp. 1920-1926. Date of Electronic Publication: 2018 Oct 30.