Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Calvin Hung Ming Chua"'
Autor:
Umesh Chand, Lakshmi Kanta Bera, Navab Singh, K.M. Han, V.Q.G. Roth, Calvin Hung Ming Chua, Surasit Chung
Publikováno v:
Materials Science Forum. 1090:141-145
In this work, we report an innovative approach to improve the interface properties of SiC/SiO2 metal oxide semiconductor (MOS) capacitors. High temperature (1350°C) oxidation under different ambient is followed by a combination of post-oxidation ann
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa8c436fcab27a5bb7e30a3544b79268
https://doi.org/10.4028/p-v0j9jt
https://doi.org/10.4028/p-v0j9jt
Autor:
Ming Chinq Jong, Simon Siak Boon Lim, Boon Long Lau, Sharon Pei Siang Lim, Xiaowu Zhang, Calvin Hung Ming Chua, Lin Bu
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In semiconductor industry, it is very attractive to develop cracking free RDL, low warpage and high solder joint reliability FOWLP. Solder joint reliability is a big issue and can lead to interconnect failure, which is related to package design, mate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0241ef6354c6564927e1d6c7d182bdb
https://doi.org/10.1109/eptc47984.2019.9026633
https://doi.org/10.1109/eptc47984.2019.9026633