Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Calvin Chua"'
Publikováno v:
Sustainable Development and Engineering Economics, Iss 1 (7), Pp 45-62 (2023)
Operational management of material resources has become a major concern for machinery enterprises. Growing interest in this issue rests on multiple reasons, primarily increasing the costs of material resources, their significant effect on efficiency
Externí odkaz:
https://doaj.org/article/63d03769924e45138a2e4a6292053340
Autor:
Lakshmi Kanta Bera, Navab Singh, Ze Yu Chen, Calvin Chua Hung Ming, King Jien Chui, Ravinder Pal Singh, Yee Ye Sheng, Surasit Chung, K. Michael Han, Ka Ren Chong, Dim Lee Kwong
Publikováno v:
Materials Science Forum. 1062:528-532
Metal-oxide-semiconductor capacitors with single and multi-layer high-K gate dielectrics on Si (0001) face of n-type 4H-SiC substrates have been investigated. Multi-layered nanolaminated gate-stack comprises alternating ultrathin (6nm) Al2O3 and HfO2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19ed6f99146f2ff8f41bb426093f045f
https://doi.org/10.4028/p-oajc69
https://doi.org/10.4028/p-oajc69
Publikováno v:
The Journal of Real Estate Finance and Economics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f9d10a903f8af83432ac3da7020db30
https://doi.org/10.1007/s11146-023-09942-3
https://doi.org/10.1007/s11146-023-09942-3
Autor:
Henry Leong, Mingsheng Zhang, Prayudi Lianto, Siew Boon Serine Soh, Tan Chin Wei, Ahmad Abdillah Haron, Guan Huei See, Ser Choong Chong, Soon Wee Ho, Zhi Hao Ko, Abdul Hakim Jumat, Peng Qi Jie, Hung Ming Calvin Chua, Seow Huang Sharon Lim, Ye Ko San, Dai Xundong, Khai Mum Peter Fung, Huan Ching Kenneth Lee
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-Out wafer-level packaging (FOWLP) semi-additive process (SAP) flow for three layers of redistribution layer (RDL) has been developed. Patched dicing lane design is adopted to improve RDL plating uniformity by ~40x, as measured by sheet resistance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3314359d49cfc1ee889fb4259a2b395d
https://doi.org/10.1109/ectc32862.2020.00181
https://doi.org/10.1109/ectc32862.2020.00181
Autor:
Arvind Sundarrajan, Bharat Bhushan, Leijun Tang, H. M. Calvin Chua, King-Jien Chui, Prayudi Lianto, Yu Gu, Guan Huei See, Ai Long Wu, Xin Wang, B. S. S. Chandra Rao
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1592-1597
Under-bump metallization R c is a critical metric for high-density interconnect in electronic devices. We developed a test vehicle to characterize the impact of unit processes on R c for 10- $\mu \text{m}$ polymer passivation opening. We demonstrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f3fdf1a6abdaad437cc85df3a84a8e
https://doi.org/10.1109/tcpmt.2017.2726118
https://doi.org/10.1109/tcpmt.2017.2726118
Autor:
Bera, Lakshmi Kanta, Singh, Navab, Chen, Ze Yu, Ming, Calvin Chua Hung, Chui, King Jien, Singh, Ravinder Pal, Sheng, Yee Ye, Chung, Surasit, Han, K. Michael, Chong, Ka Ren, Kwong, Dim Lee
Publikováno v:
Materials Science Forum; May 2022, Vol. 1062 Issue: 1 p528-532, 5p
Autor:
J. Jayabalan, Calvin Chua Hung Ming, Jong Ming Chinq, Sharon Lim Pei Siang, Vivek Chidambaram, Surya Bhattacharya
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Via-Last TSV based 2.5D/3D IC packaging is actively being pursued for its ability to extend Moore’s law beyond the limitations inherent in 2D packaging, though challenges for optimizing electrical test continue to be addressed. This paper discusses
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64cc65eb0a265046705574c6292d6b69
https://doi.org/10.1109/eptc.2018.8654428
https://doi.org/10.1109/eptc.2018.8654428
Publikováno v:
25th Annual European Real Estate Society Conference.
Discrimination is prevalent in the world. There are many pieces of research literature undertaken that studied the various forms of discrimination in the labour market. Discrimination occurs due to different reasons such as nationalities, skin colour
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::317447ab641984e419e421504dea0c1b
https://doi.org/10.15396/eres2018_305
https://doi.org/10.15396/eres2018_305
Autor:
Mark Dwyer, Calvin Chua
Publikováno v:
Sustainable Cities
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::125a8b6905cb81d7a477159a6b98a753
https://doi.org/10.5040/9781350988323.ch-004
https://doi.org/10.5040/9781350988323.ch-004
Autor:
Low, Eu Poh Leng, A. D. Trigg, Sheryl Yong Puay Fen, Calvin Chua Hung Ming, V. P. Ganesh, Chai Tai Chong, Chen Ping, Sharon Chan Sok Mung, Tan Lan Chu, Jasmond Lee Thiam Kwee
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
The use of copper wire for wire bonding integrated circuits (ICs) has increased significantly in recent years, driven mainly by the dramatic increase in the cost of gold. The technical advantages and limitations, particularly with respect to reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714921e40f72c865511536c9693d613b
https://doi.org/10.1109/eptc.2012.6507072
https://doi.org/10.1109/eptc.2012.6507072