Key low temperature processes for a silicon-based 3D sequential integration

Autor: Garros, Xavier, Batude, Perrine, Fenouillet-Beranger, Claire, Brunet, Laurent, Calvacante, Camila, Mota Frutuoso, Tadeu, Gassilloud, Remy, Ribotta, Mickael, Brevard, Laurent, Lapras, Valerie, Andrieu, François, Gaillard, Fréd

Publikováno v: 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS
2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States

International audience

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::5c9c04e15cdc4a6e589c744796158865
https://cea.hal.science/cea-03740747