Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Callen Votzke"'
Autor:
Calder Wilson, Joseph Karam, Callen Votzke, Farhan Rozaidi, Camille J. Palmer, Ross L. Hatton, Matthew L. Johnston
Publikováno v:
2023 IEEE International Conference on Soft Robotics (RoboSoft).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fbde672067e7f2cc86936248b80da82
https://doi.org/10.1109/robosoft55895.2023.10121925
https://doi.org/10.1109/robosoft55895.2023.10121925
Publikováno v:
2022 Opportunity Research Scholars Symposium (ORSS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c7217a8eb07e01a22b1a6fa3542bfd6
https://doi.org/10.1109/orss55359.2022.9806039
https://doi.org/10.1109/orss55359.2022.9806039
Publikováno v:
2022 IEEE 5th International Conference on Soft Robotics (RoboSoft).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51e2b51ecfd1888294c86d1956205394
https://doi.org/10.1109/robosoft54090.2022.9762152
https://doi.org/10.1109/robosoft54090.2022.9762152
Autor:
Lisa M. Dischinger, Miranda Cravetz, Jacob Dawes, Callen Votzke, Chelse VanAtter, Matthew L. Johnston, Cindy M. Grimm, Joseph R. Davidson
Publikováno v:
2021 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14af8230744cae6fb4cfb0c49917a739
https://doi.org/10.1109/iros51168.2021.9636341
https://doi.org/10.1109/iros51168.2021.9636341
Publikováno v:
2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
Liquid metals, in combination with compliant substrates such as silicone, provide a versatile material system for creating stretchable electrical conductors. A variety of methods have been demonstrated for fabricating stretchable wires and electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10a198ae84d32cb4f3a4c7acc000b1bc
https://doi.org/10.1109/fleps51544.2021.9469786
https://doi.org/10.1109/fleps51544.2021.9469786
Publikováno v:
2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
Liquid metal has emerged as a leading material choice for stretchable interconnects, owing to its high conductivity and unlimited maximum strain at room temperature. However, repeatably and reliably patterning and attaching components to fluidic inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07090a1f06b95c28edf8cb3e11e36e6a
https://doi.org/10.1109/fleps51544.2021.9469816
https://doi.org/10.1109/fleps51544.2021.9469816
Publikováno v:
IEEE Sensors Journal. 19:3832-3840
Stretchable electronic circuits and systems will be critical for future wearable devices and smart textiles, where existing flexible printed circuit board techniques severely limit conformal deformation. In this paper, we present a scalable fabricati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fbb89b2c4536a7985db81142e74bda0
https://doi.org/10.1109/jsen.2019.2894405
https://doi.org/10.1109/jsen.2019.2894405
Publikováno v:
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
Stretchable electronic devices require interconnects that are able to elastically deform to high levels of strain [1] . Such stretchable interconnects require new conductor geometries for metallic traces [2] or inherently-stretchable materials, such
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a9647246791b911c45d4e5d2d455d55
https://doi.org/10.1109/fleps.2019.8792306
https://doi.org/10.1109/fleps.2019.8792306
Publikováno v:
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
One method for fabricating stretchable electronics uses highly-stretchable electrical interconnects and traditionallypackaged integrated circuits (IC) encapsulated in a stretchable substrate, similar to a printed circuit board (PCB) [1] , [2] . Unlik
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0cd67ba7676a154d4bd932eadb1e608
https://doi.org/10.1109/fleps.2019.8792265
https://doi.org/10.1109/fleps.2019.8792265
Publikováno v:
BioCAS
Stretchable electronic circuits and systems will be critical for future wearable devices and smart textiles, where existing rigid and flexible fabrication approaches severely limit conformal deformation. This is especially true for wearable sensors a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b11629f468b9ad3286513c654252c983
https://doi.org/10.1109/biocas.2018.8584671
https://doi.org/10.1109/biocas.2018.8584671