Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Caixin Hui"'
Autor:
Jie Jiang, Qiuqi Chen, Shengdong Hu, Yijun Shi, Zhiyuan He, Yun Huang, Caixin Hui, Yiqiang Chen, Hao Wu, Guoguang Lu
Publikováno v:
Materials, Vol 16, Iss 4, p 1484 (2023)
This work investigated the effects of single stress and electro-thermo-mechanical coupling stress on the electrical properties of top-cooled enhancement mode (E-mode) Aluminium Gallium Nitride/Gallium Nitride (AlGaN/GaN) high electron mobility transi
Externí odkaz:
https://doaj.org/article/fc984d18a6be4d10a1aa012e694963e6
Autor:
Caixin Hui, Qiuqi Chen, Yijun Shi, Zhiyuan He, Yun Huang, Xiangjun Lu, Hongyue Wang, Jie Jiang, Guoguang Lu
Publikováno v:
Micromachines, Vol 13, Iss 12, p 2101 (2022)
To study the working performance of 3D stacked chips, a double-layer stacked GaN MISHEMTs structure was designed to study the electro-thermal characteristics and heat transfer process of stacked chips. Firstly, the electrical characteristics of doubl
Externí odkaz:
https://doaj.org/article/454a8bafde79447584469fbea4f39909
Autor:
Caixin Hui, Peng Zhao, Yun Huang, Zhiyuan He, Xiangjun Lu, Jie Jiang, Yijun Shi, Guoguang Lu, Bin Shen
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).