Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency

Autor: Wong, E.H., Seah, S.K.W., Caers, J.F.J.M., Lai, Y.-S.

Publikováno v: In International Journal of Fatigue February 2014 59:43-49

Correlation studies for component level ball impact shear test and board level drop test

Autor: Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.

Publikováno v: In Microelectronics Reliability 2008 48(7):1069-1078

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

Autor: Okura, J.H ^*, Shetty, S, Ramakrishnan, B, Dasgupta, A, Caers, J.F.J.M, Reinikainen, T

Publikováno v: In Microelectronics Reliability 2000 40(7):1173-1180

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Autor: Yang, D.G., Zhang, G.Q., Ernst, L.J., van 't Hof, C., Caers, J.F.J.M., Bressers, H.J.L., Janssen, J.H.J.

Publikováno v: IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies]

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=narcis______::f08e2794d52b984f5eba0afcce8a2433
http://resolver.tudelft.nl/uuid:99943327-4858-44b2-9cbc-045c2f154c46

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Autor: Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

Publikováno v: In Materials Letters 2008 62(17):3031-3034