Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Cadmus C. A. Yuan"'
Autor:
Cadmus C. A. Yuan, Chang-Chi Lee
Publikováno v:
IEEE Access, Vol 8, Pp 143494-143501 (2020)
This article combines the sequential artificial neural network (NN) machine learning with finite element (FE) modeling to assess the solder joint thermal cycling performance. A glass wafer-level chip-scale package (G-WLCSP) is used for this study. Th
Externí odkaz:
https://doaj.org/article/0a0934b6768c42c184157f8d8aff6810
Publikováno v:
Journal of Mechanics. 38:539-551
Wire bonding is a key integrated circuit (IC) interconnect technology, and it adheres metal wires to the IC pad and substrate by applying significant compression and energic loading. On the other hand, the Cu/low-k technology of the advanced IC indus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ab5c5e190b401bbc65cf430270dc309
https://doi.org/10.1093/jom/ufac044
https://doi.org/10.1093/jom/ufac044
Publikováno v:
Journal of Mechanics. 37:659-668
Elderly people suffer from more and more teeth problems. The tooth-implant-supported prosthesis provides a reliable solution to missing teeth patients. The proper dental prosthesis design to prevent overstress is essential due to the mechanical chara
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88c889f2589ccec57fdaa17e00026f5a
https://doi.org/10.1093/jom/ufab030
https://doi.org/10.1093/jom/ufab030