Characterization and Process Development of CVD/ALD-based Cu(Mn)/Co(W) Interconnect System

Autor: Shima, Kohei, Tu, Yuan, Han, Bin, Takamizawa, Hisashi, Shimizu, Hideharu, Shimizu, Yasuo, Momose, Takeshi, Inoue, Koji, Nagai, Yasuyoshi, Shimogaki, Yukihiro

Publikováno v: AMC 2015 – Advanced Metallization Conference

A new materials system of a single layered Co(W) barrier/liner coupled with a Cu(Mn) alloy seed was investigated. Atom probe tomography visualized the sub-nanoscale structure of Cu(Mn)/Co(W) system, and thereby revealed Cu diffusion behavior of Co(W)

Externí odkaz: https://monarch.qucosa.de/id/qucosa%3A19502
https://monarch.qucosa.de/api/qucosa%3A19502/attachment/ATT-0/
https://monarch.qucosa.de/api/qucosa%3A19502/attachment/ATT-1/

CVD techniques for surface functionalization: ALD potentiality for long-range periodic structures

Autor: Naida El Habra, Francesca Visentin, Alessandro Galenda, Rosalba Gerbasi

Publikováno v: Conferenza di Dipartimento 2017 DSCTM, pp. 118–118, Alghero, 19-20/10/2017
info:cnr-pdr/source/autori:Naida El Habra,*, Francesca Visentin, Alessandro Galenda, Rosalba Gerbasi/congresso_nome:Conferenza di Dipartimento 2017 DSCTM/congresso_luogo:Alghero/congresso_data:19-20%2F10%2F2017/anno:2017/pagina_da:118/pagina_a:118/intervallo_pagine:118–118

The surface of a solid material and the regions closest to it represent the 'element of dialogue' with the surrounding environment, so conditioning the physical and chemical properties of the material itself. In this context, Material Science is fund

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::915f6a6cc4c79e6c59f6c9d4152c1f7c
http://hdl.handle.net/11577/3304188

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