Zobrazeno 1 - 10
of 118
pro vyhledávání: '"CTE mismatch"'
Autor:
Capela, Paulina Araújo, Souza, Maria Sabrina, Costa, Sharlane, Teixeira, Jose C., Fernandes, Miguel, Figueiredo, Hugo, Delgado, Isabel, Soares, Delfim
Publikováno v:
Soldering & Surface Mount Technology, 2022, Vol. 35, Issue 2, pp. 70-77.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2022-0035
Autor:
Bernhard Czerny, Sebastian Schuh
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2002 (2023)
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigue is one of the main reliability issues in power LED devices. Currently, the standard testing methods to evaluate the device’s lifetime involve time
Externí odkaz:
https://doaj.org/article/3e3503f9519142a493f5f3caa4d7cea4
Autor:
Xiaolin Dang, Donglin Zhao, Tong Guo, Xiaomeng Fan, Jimei Xue, Fang Ye, Yongsheng Liu, Laifei Cheng
Publikováno v:
Journal of Advanced Ceramics, Vol 11, Iss 2, Pp 354-364 (2022)
Abstract Oxidation behaviors of carbon fiber reinforced SiC matrix composites (C/SiC) are one of the most noteworthy properties. For C/SiC, the oxidation behavior was controlled by matrix microcracks caused by the mismatch of coefficients of thermal
Externí odkaz:
https://doaj.org/article/bc4181ae32084ad4a51fa78b06c9205b
Publikováno v:
Multidiscipline Modeling in Materials and Structures, 2020, Vol. 17, Issue 2, pp. 451-464.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MMMS-05-2020-0125
Publikováno v:
Microelectronics International, 2020, Vol. 37, Issue 4, pp. 181-188.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-04-2020-0020
Publikováno v:
IEEE Access, Vol 8, Pp 43314-43324 (2020)
Structural thermal deformation is an important factor that affects the performance of MEMS devices. The mismatch of thermal expansion coefficient (CTE) between different materials is a major source. For single center supported MEMS devices, expansion
Externí odkaz:
https://doaj.org/article/a75d35df86c6438e8462e0d159d007de
Akademický článek
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Akademický článek
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Publikováno v:
Manufacturing Review, Vol 7, p 14 (2020)
Monitoring the deformation within an adhesive joint during the curing cycle provides valuable information regarding the build-up of thermal strain and stress. Distributed fibre optic sensors are very useful for spatial continuous measurements of defo
Externí odkaz:
https://doaj.org/article/8f29478137be4788a6dd7e54c4896935
Autor:
Qin, Xian
The trend to high I/O density, performance and miniaturization at low cost is driving the industry towards shrinking interposer design rules, requiring a new set of packaging technologies. Low-CTE packages from silicon, glass and low-CTE organic subs
Externí odkaz:
http://hdl.handle.net/1853/53532
