Zobrazeno 1 - 10
of 1 100
pro vyhledávání: '"CIRCUIT board manufacturing"'
Autor:
Chang, Ping-Chen1 (AUTHOR), Huang, Cheng-Fu2 (AUTHOR) cfuhuang@fcu.edu.tw, Fiondella, Lance3 (AUTHOR)
Publikováno v:
Quality Technology & Quantitative Management. Nov2024, Vol. 21 Issue 6, p1025-1041. 17p.
Autor:
Kasemsin, Wassana1, Boonkirdram, Sarawoot1 sarawoot.b@snru.ac.th
Publikováno v:
EUREKA: Physics & Engineering. 2024, Issue 5, p64-72. 9p.
Autor:
Wang, Bei1,2 (AUTHOR), Prasad, Sonal3 (AUTHOR), Hellman, Oskar2 (AUTHOR), Li, Hao4 (AUTHOR), Fridberger, Anders3 (AUTHOR), Hjort, Klas2 (AUTHOR) klas.hjort@angstrom.uu.se
Publikováno v:
Advanced Functional Materials. Aug2024, Vol. 34 Issue 31, p1-12. 12p.
Autor:
Tanakasempipat, Patpicha (AUTHOR), Yuvejwattana, Suttinee (AUTHOR)
Publikováno v:
Bloomberg.com. 10/22/2024, pN.PAG-N.PAG. 1p.
Publikováno v:
Business Post Nigeria. 10/18/2024, pN.PAG-N.PAG. 1p.
Autor:
BUETOW, MIKE1 mike@pcea.net
Publikováno v:
Printed Circuit Design & Fab: Circuits Assembly. Oct2024, Vol. 41 Issue 10, p101-105. 5p.
Autor:
Bhattacharya, Abhiroop1 (AUTHOR), Cloutier, Sylvain G.1 (AUTHOR) SylvainG.Cloutier@etsmtl.ca
Publikováno v:
Scientific Reports. 7/22/2022, Vol. 12 Issue 1, p1-13. 13p.
Publikováno v:
Productronic. 4/23/2024, p42-43. 2p.
Autor:
Zhu, Jianfei1 (AUTHOR) zhujianfei@hfut.edu.cn, Gao, Guoliang1 (AUTHOR) 2021170072@mail.hfut.edu.cn, Lai, Weien1 (AUTHOR) wnlai@hfut.edu.cn
Publikováno v:
AIP Advances. Apr2024, Vol. 14 Issue 4, p1-7. 7p.
Publikováno v:
SMT007 Magazine. Nov2023, Vol. 38 Issue 11, p34-42. 7p.