Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems

Autor: Günter Elst, Peter Schneider, Andreas Wilde, Peter Schwarz, Sven Reitz

Publikováno v: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
DTIP 2007
DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.162-168

Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to des

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::500d4d237dadab5fb42ac4a2801e0a27
https://doi.org/10.1007/s10470-008-9143-3

Model for Gas Damping in Air Gaps of RF MEMS Resonators

Autor: Timo Veijola, Anu Lehtovuori

Publikováno v: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
DTIP 2007
DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. TIMA Editions, pp.156-161, 2007
Aalto University

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing); International audience; Damping in air gaps is studied at RF frequencies and modelled with a viscoelastic wave propagation model, since the traditional squeez

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::dc0c2c25aedfedecddb7d3d93de67ebf
https://hal.archives-ouvertes.fr/hal-00257680