Zobrazeno 1 - 10
of 434
pro vyhledávání: '"C.S. Hsu"'
Publikováno v:
Applied Mechanics and Materials. :315-318
This study explores a series of optical, physical and structural properties based on P2O5-Al2O3-ZnO (ZAP) with glass doped 1 mol% Tb2O3, which changed the composition ratio between ZnO and P2O5. The structure and optical of glasses were studies by Ra
Publikováno v:
Thin Solid Films. 519:4958-4962
The properties of electroless CoWP barrier films with different phosphorus contents in Cu/CoWP/Si stacked samples were explored. The Cu/CoWP/Si stacked samples with 30 nm CoWP films, contained about 5.7, 8.2 and 10.8 at.% P, were prepared by electrol
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Publikováno v:
Thin Solid Films. 517:1274-1278
An electrochemical seeding process without involving sensitization-activation and displacement-activation is presented to grow catalytic particles of sizes only ~ 4 nm, subsequently initializing the deposition of Co–B and Co–W–B barrier layers
Publikováno v:
Journal of Electronic Materials. 37:852-859
Copper thin films with high conductivity and good resistance to electromigration can be used in advanced electronic devices. However, the poor corrosion resistance of copper must be overcome. This work elucidates the possibility of using a self-formi
Publikováno v:
Journal of Physics and Chemistry of Solids. 69:430-434
TaxNi1−x (x=0.65 and 0.50) thin films were prepared on p-type (1 0 0) Si substrate by magnetron dc sputtering as a barrier film with a high crystallization temperature and a low resistivity for Cu metallization. The failure properties of the studie
Autor:
C.S. Hsu
For many years, I have been interested in global analysis of nonlinear systems. The original interest stemmed from the study of snap-through stability and jump phenomena in structures. For systems of this kind, where there exist multiple stable equil
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Publikováno v:
Vacuum. 83:708-710
This study describes the process of growing densely distributed metallic seeds of sizes ∼4 nm on SiO 2 dielectric layers by sequential treatment in N 2 –H 2 vacuum plasma (to activate the surfaces) and an aqueous solution of metallic salt (to ads