Výsledky vyhledávání - "C.R. de Boer"

The impact of route guidance, departure time advice and alternative routes on door-to-door travel time reliability: Two data-driven assessment methods

Autor: Maaike Snelder, B. van Arem, C.R. de Boer, R. van Nes

Publikováno v: Journal of Intelligent Transportation Systems, 6, 21, 465-477
Journal of Intelligent Transportation Systems: technology, planning, and operations

Conventional travel time reliability assessment has evolved from road segments to the route level. However, a connection between origin and destination usually consists of multiple routes, thereby providing the option to choose. Having alternatives c

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3f91e6b6fefba960ee5066e3197122c7
http://resolver.tudelft.nl/uuid:cbc726d1-3b6d-485e-ada8-ffeae8381816

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Planar antiresonant reflecting optical waveguides as integrated optical refractometer

Autor: Pasqualina M. Sarro, Luigi Zeni, C.R. de Boer, Romeo Bernini, Stefania Campopiano

Publikováno v: IEEE sensors journal 3 (2003): 652–657.
info:cnr-pdr/source/autori:Bernini R, Campopiano S, de Boer C, Sarro PM, Zeni L/titolo:Planar antiresonant reflecting optical waveguides as integrated optical refractometer/doi:/rivista:IEEE sensors journal/anno:2003/pagina_da:652/pagina_a:657/intervallo_pagine:652–657/volume:3

This paper reports on an integrated refractometer sensor, useful for measuring chemical quantities, based on antiresonant reflecting optical waveguides (ARROWs). We show that, by a suitable design, the attenuation in ARROW waveguides can strongly dep

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3845e975223bff252f9ce04d0f27770e
https://doi.org/10.1109/jsen.2003.817166

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Silicon nitride as dielectric in the low temperature SiGe HBT processing

Autor: C.R. de Boer, H.W. van Zeijl, Q.W. Ren, Lis K. Nanver

Publikováno v: Microelectronic Engineering. 36:179-182

Low-stress silicon-rich SiNx deposited at or below 700 °C by either LPCVD or PECVD has been studied for potential use in the surface processing of a 45 GHz SiGe HBT IC-process. The films underwent a thermal anneal at 700 °C and in all cases a thin

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::979bb518d95e9ae67d627b71dd598e67
https://doi.org/10.1016/s0167-9317(97)00043-9

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Microhotplates with TiN heaters

Autor: C.R. de Boer, N. F. de Rooij, W. van der Vlist, Hendrik Willem Zandbergen, J.F. Creemer, Danick Briand, Pasqualina M. Sarro

Titanium nitride (TiN) has been investigated as a heater material for microhotplates and microreactors. TiN is available in many CMOS processes, unlike many other microheater materials. In addition, TiN has a very high melting point (2950 ◦C) meani

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::738578d15352dda261bb817489d22269
http://doc.rero.ch/record/17014/files/Creemer_J._F._-_Microhotplates_with_TiN_heaters_20100411.pdf

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In-Situ Isotropic and Anisotropic DRIE Sequence for Massive Parallel Multistage Brownian Ratchets

Autor: Jia Wei, Pasqualina M. Sarro, C.R. de Boer, H.T.M. Pham

Publikováno v: TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

In this paper an in-situ isotropic and anisotropic deep reactive ion etching (DRIE) sequence process is presented to obtain a periodic asymmetric variation along the z-axis in pore diameter on silicon wafers, which can act as massively parallel and m

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::38881e6fb5e53e88a2331e140fa762c6
https://doi.org/10.1109/sensor.2007.4300176

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Non-catalyst and low temperature growth of vertically aligned carbon nanotubes for nanosensor arrays

Autor: H.T.M. Pham, C.R. de Boer, Pasqualina M. Sarro

Publikováno v: The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

In this paper we present a new technique to vertically grow aligned carbon nanotubes (CNTs) on nanosize pore anodic aluminum oxide (AAO) templates on a Si substrate. The CNTs are grown using methane in an RF PECVD system at only 400/spl deg/C without

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8102efa684ca0c4214a3d810da57caef
https://doi.org/10.1109/sensor.2005.1496368

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Polyimide sacrificial layer for an all-dry post-process surface micromachining module

Autor: Patrick J. French, Pasqualina M. Sarro, Alvise Bagolini, J.M.W. Laros, C.R. de Boer, H.T.M. Pham, L. Pakula

Publikováno v: TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

In this paper we present a novel post-process surface micromachining module that uses a commercial PI2610 polyimide as a sacrificial layer and PECVD SiC or SiN as structural layers. No wet etching is required thus avoiding stiction problems often enc

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6c6609529275348ab3b4e576bc2716eb
https://doi.org/10.1109/sensor.2003.1215598

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High aspect ratio through-wafer interconnections for 3D-microsystems

Autor: Cassan C. C. Visser, A. Nichelatti, Lianwei Wang, C.R. de Boer, H. Schellevis, T.N. Nguyen, Pasqualina M. Sarro

Publikováno v: The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE.

Closely spaced, through-wafer interconnects are of large interest in RF MEMS and MEMS packaging. In this paper, a suitable technique to realize large arrays of small size through-wafer holes is presented. This approach is based on macroporous silicon

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::645e2a2770eced531362d216cf3caa43
https://doi.org/10.1109/memsys.2003.1189829

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Phased-array wavelength demultiplexer with flattened wavelength response

Autor: J.J.G.M. van der Tol, F.P.G.M. van Ham, T. Demeester, MK Meint Smit, M.R. Amersfoort, C.R. de Boer, A. Kuntze

Publikováno v: Electronics Letters. 30:300-302

A four-channel phased-array wavelength demultiplexer with a flattened wavelength response has been realised for the first time in InP/InGaAsP at 1.54 mu m by employing multimode output waveguides. The device has 2 nm channel spacing and a flat respon

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ef5438d2e4334dcba70f3b859769a600
https://doi.org/10.1049/el:19940249

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Low-loss phased-array based 4-channel wavelength demultiplexer integrated with photodetectors

Autor: J.J.G.M. van der Tol, Piet Demeester, A. Looyen, C.R. de Boer, M.R. Amersfoort, BH Verbeek

Publikováno v: IEEE Photonics Technology Letters, 6 (1)

A 4-channel phased-array wavelength division demultiplexer with 1.8 nm channel spacing at 1.54 /spl mu/m has been monolithically integrated with photodetectors in InP/InGaAsP. On chip losses are 3.5 to 4.5 dB. These are the lowest losses reported so

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7df6205eef5066e96edc1954f949bbe2
https://doi.org/10.1109/68.265890

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