Zobrazeno 1 - 10
of 54
pro vyhledávání: '"C.M. Pettit"'
Publikováno v:
Journal of The Electrochemical Society. 161:H583-H592
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdae7bc63ad05fe6cc87a7b3ef0e73a1
https://doi.org/10.1149/2.1201409jes
https://doi.org/10.1149/2.1201409jes
Publikováno v:
Thin Solid Films. 520:2892-2900
Chemical mechanical planarization (CMP) of tantalum nitride is an essential step of material processing in the fabrication of integrated circuits. This CMP step often involves the chemical formation of a structurally weak oxide-complex film on the wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c161c3292aead485be36cccf498abe5
https://doi.org/10.1016/j.tsf.2011.12.005
https://doi.org/10.1016/j.tsf.2011.12.005
Publikováno v:
Surface and Interface Analysis. 44:801-810
Surface plasmon resonance (SPR) and electrochemical measurements are combined in this work to study the interactions of a gold film electrode with aqueous electrolytes of an ionic liquid (IL), 1-ethyl-3-methyl-imidazolium ethyl sulfate. The optical r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::312e95c4991b717980a63ea987a7d7a9
https://doi.org/10.1002/sia.4808
https://doi.org/10.1002/sia.4808
Publikováno v:
Materials Chemistry and Physics. 129:1159-1170
The fabrication of interconnect structures for semiconductor devices requires low down-pressure chemical mechanical planarization (CMP) of Ta barrier layers. Guanidine carbonate (GC) serves as an effective surface-complexing agent for such CMP applic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::262585894b431521b7384e9b27cebc47
https://doi.org/10.1016/j.matchemphys.2011.05.079
https://doi.org/10.1016/j.matchemphys.2011.05.079
Publikováno v:
Journal of Applied Electrochemistry. 41:561-576
Nitrate, sulfate, and phosphate oxyanions are shown to serve as effective surface-modifying agents for low-pressure chemical–mechanical planarization (CMP) of Ta and TaN barrier layers of interconnect structures. The surface reactions that form the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::269cc4c8207a638cb63bb18fcb178c90
https://doi.org/10.1007/s10800-011-0262-7
https://doi.org/10.1007/s10800-011-0262-7
Publikováno v:
Talanta. 78:1056-1062
Carbon nanotube (CNT) electrodes in combination with ionic liquid (IL) electrolytes are potentially important for energy storage systems. We report electrochemical investigation of such a system involving a paper-electrode of multi-wall CNT (MWCNT) i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::18e8e6606f248cdb47d03843de22035b
https://doi.org/10.1016/j.talanta.2009.01.014
https://doi.org/10.1016/j.talanta.2009.01.014
Publikováno v:
Journal of Applied Electrochemistry. 38:1347-1356
Dissolution inhibition capabilities of benzotriazole (BTAH) and ammonium dodecyl sulfate (ADS) are investigated, in combination with β-alanine, as a complexing agent for applications in electrochemical mechanical planarization (ECMP) of copper. Cu e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dcf75b40c231de04d9bf04e6336358a
https://doi.org/10.1007/s10800-008-9570-y
https://doi.org/10.1007/s10800-008-9570-y
Publikováno v:
Journal of Electroanalytical Chemistry. 589:219-231
The differential capacitance (Cdiff) technique is widely employed in studies of metal–liquid interfaces, and is particularly useful for probing electrochemical effects of surface charge variations under voltage control. For such applications, howev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84afee4014c451e002755a5240ed0549
https://doi.org/10.1016/j.jelechem.2006.02.012
https://doi.org/10.1016/j.jelechem.2006.02.012
Autor:
Dipankar Roy, C.M. Pettit
Publikováno v:
Materials Letters. 59:3885-3889
Chemical mechanical planarization (CMP) is currently used in the processing of Cu/Ta interconnect structures. Electrochemical mechanical planarization (ECMP) is an emerging extension of CMP that can potentially allow low down-pressure planarization o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::958991e821763049c813eda85418bfb8
https://doi.org/10.1016/j.matlet.2005.07.025
https://doi.org/10.1016/j.matlet.2005.07.025
Publikováno v:
Materials Chemistry and Physics. 86:347-357
This work presents an electrochemical investigation of chemical reactions kinetics in chemical–mechanical polishing of Ta in a peroxide-based alkaline medium. Time resolved Fourier transform electrochemical impedance spectroscopy is combined with c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05f346f1aff4e8f7d24a5b712428c455
https://doi.org/10.1016/j.matchemphys.2004.03.016
https://doi.org/10.1016/j.matchemphys.2004.03.016