Zobrazeno 1 - 10
of 28
pro vyhledávání: '"C.J. Sherman"'
Autor:
P.J. Anthony, S.R. Peck, Yiu-Man Wong, J.V. Gates, J.S. Nyquist, J.S. Helton, W.K. Honea, B. Holland, G.L. Sonnier, C.C. Faudskar, C.J. Sherman, J.P.C. Markush, E.G. Priest, C.A. Lepthian, G.J. Grimes, D.J. Muehlner, J.R. Bortolini
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 20:409-415
Optoelectronic modules and multifiber optical connectors were successfully applied to intrasystem interconnection within a large telecommunication transmission terminal. The optoelectronic modules are 32-channel 850 nm vertical cavity surface emittin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e62511805820fbd6651485ddfac96e1
https://doi.org/10.1109/96.641509
https://doi.org/10.1109/96.641509
Autor:
W.K. Honea, W.W. Jamison, K.S. Rausch, L.L. Blyler, C.J. Sherman, J.S. Helton, S.R. Peck, W.J. Parzygnat, R. Bonanni, R.J. Nadler, Gary J. Grimes, R.W. Garvert, J.J. Thomas
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
We report on the first circuit board having passive optical circuits in combination with a backplane multifiber array connector. The approach uses four fused biconical tapered optical couplers in combination with a 12 fiber multifiber array connector
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbc10d0d9255427dee1e6c31666ab98c
https://doi.org/10.1109/ectc.1993.346770
https://doi.org/10.1109/ectc.1993.346770
Autor:
G.J. Grimes, J.P.C. Markush, Y.M. Wong, P.J. Anthony, W.R. Holland, E.G. Priest, C.J. Sherman, S.R. Peck, D.J. Muehlner, C.C. Faudskar, J.S. Nyquist, J.S. Helton, G.L. Sonnier, J.V. Gates, W.K. Honea, J.R. Bortolini
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a61abeeb605ed47f12e3c522741e0afb
https://doi.org/10.1109/ectc.1996.517435
https://doi.org/10.1109/ectc.1996.517435
Autor:
W.K. Honea, J.S. Helton, J.R. Bortolini, G.J. Grimes, W.R. Holland, P.J. Anthony, J.P.C. Markush, C.J. Sherman, S.R. Peck, G.L. Sonnier, D.J. Muehler, C.C. Faudskar, J.V. Gates, Yiu-Man Wong, J.S. Nyquist, E.G. Priest
Publikováno v:
Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society.
The first phase of OETC (OETC-1) produced a parallel, 32-channel, high density (140 mm pitch), 500 Mb/s NRZ, point to point, optical data link. This link has a 32 channel VCSEL array operating at 850 nm and a 32 channel MCM receiver array. The key pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5cd21629a4ec3e4216cef89271f7ece
https://doi.org/10.1109/leos.1996.571520
https://doi.org/10.1109/leos.1996.571520
Publikováno v:
Proceedings of LEOS'94.
Summary form only given. Optical backplanes can enhance the functionality of large system products at reasonable cost. In order to further exploit high technology, high fibre count multivendor multifiber array backplane connectors are needed. Interma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ec037ece7c1e67189bcd69fc3ddf0c9
https://doi.org/10.1109/leos.1994.586973
https://doi.org/10.1109/leos.1994.586973
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Large telecommunication switching and transmission platforms have massive interconnection requirements which are in the 1 Tb/s range and growing rapidly. Plastic optical fiber technology shows promise as a replacement for both metallic interconnectio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8809a6ab2edf28e50b0246dcfb371798
https://doi.org/10.1109/ectc.1998.678829
https://doi.org/10.1109/ectc.1998.678829
Publikováno v:
1995 Proceedings. 45th Electronic Components and Technology Conference.
Optical backplanes based on todays' technologies can offer important advantages to both manufacturers of telecommunications platforms and telecommunications service providers. The DACS VI-2000 digital access and cross-connect system was the first veh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::106964abd756fb2fb53d61be0ec9596d
https://doi.org/10.1109/ectc.1995.515337
https://doi.org/10.1109/ectc.1995.515337
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A discontinuity in interconnection requirements and total system bandwidth caused by DWDM technology a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8fd49d77b5102077ba761b28b78dfeb
https://doi.org/10.1109/ectc.2000.853337
https://doi.org/10.1109/ectc.2000.853337
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Akademický článek
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