Zobrazeno 1 - 10
of 43
pro vyhledávání: '"C.-A. Manier"'
Autor:
Zoltan Sarkany, C. A. Manier, M. Springborn, J. Heilmann, Hermann Oppermann, Bernhard Wunderle, Radoslava Mitova, M. Abo Ras, Daniel May
Publikováno v:
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Novel concepts in power electronics rely heavily on the availability and processability of new materials and packaging technologies to meet the requirements of increasing performance and reliability at lower form factor, weight and cost. Today’s ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3fe9f1c50cd9d091994ba5ee22039f8
https://doi.org/10.1109/therminic.2018.8593293
https://doi.org/10.1109/therminic.2018.8593293
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 43:1019-1028
The slip-rolling resistances of hard and stiff thin films under high Hertzian contact pressures can be improved by optimizing the “coating/substrate systems”. It is known from former investigations that the so-called “egg-shell” effect is no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b6616ef4e3f8e23548582bcf4f8a9668
https://doi.org/10.1002/mawe.201200956
https://doi.org/10.1002/mawe.201200956
Publikováno v:
Wear. 268:1442-1454
The light-weight approach and fuel economy targets in today's automotive engineering require tribosystems, which can withstand higher contact pressures associated with low coefficients of friction. The application of high-performance coatings represe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::453a57bf79bb10713ce8dab4b33474eb
https://doi.org/10.1016/j.wear.2010.02.020
https://doi.org/10.1016/j.wear.2010.02.020
Publikováno v:
Matériaux & Techniques. 97:397-409
Le secteur automobile doit faire face actuellement a de nouveaux challenges au niveau de la construction allegee, des economies de carburant et des couts. Ces exigences motivent la mise au point de tribosystemes pouvant resister a des pressions de co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1ca6fe915f7e51e8158fc7541326ac3
https://doi.org/10.1051/mattech/2009051
https://doi.org/10.1051/mattech/2009051
Publikováno v:
Diamond and Related Materials. 17:1751-1754
Costs reduction is one of the major objectives in mechanical applications with a parallel increase of the power output. Another driver represents new environmental standards and their increasing restrictions in the automotive industry leading to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f095de971f742448ec3c77394ddf6dcc
https://doi.org/10.1016/j.diamond.2008.01.066
https://doi.org/10.1016/j.diamond.2008.01.066
Autor:
C. A. Manier, N. Scolari, James Dekker, D. Ruffieux, T. C. Le, P.A. Beuchat, K. Zoschke, Antti Jaakkola, Tuomas Pensala, Pradeep Dixit, H. Oppermann
Publikováno v:
2014 European Frequency and Time Forum (EFTF).
This paper presents a miniature timing microsystem based on a pair of wafer-level packaged co-integrated low and high frequency silicon resonators −430kHz and 26MHz respectively- so as to implement a μW-level accurate, low power, temperature-compe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47e25f6b806605741e2e63503f533a5a
https://doi.org/10.1109/eftf.2014.7331529
https://doi.org/10.1109/eftf.2014.7331529
Autor:
Antti Jaakkola, James Dekker, J. Baborowski, N. Scolari, K. Zoschke, C. A. Manier, Tuomas Pensala, T. C. Le, H. Oppermann, David Ruffieux
Publikováno v:
Ruffieux, D, Baborowski, J, Scolari, N, Le, T C, Jaakkola, A, Pensala, T, Dekker, J, Manier, C A, Zoschke, K & Oppermann, H 2013, A miniature timing microsystem using two silicon resonators . in 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC) . IEEE Institute of Electrical and Electronic Engineers, pp. 750-753, Joint European Frequency and Time Forum and International Frequency Control Symposium, EFTF/IFC 2013, Prague, Czech Republic, 21/07/13 . https://doi.org/10.1109/EFTF-IFC.2013.6702234
This paper presents a miniature timing microsystem based on a pair of co-integrated low and high frequency silicon resonators -430kHz or 522kHz and 26MHz respectively-so as to implement a μW-level accurate, low power, temperature-compensated real ti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b5001ddc86e60f8f5cc7df53767a7b6
https://doi.org/10.1109/EFTF-IFC.2013.6702234
https://doi.org/10.1109/EFTF-IFC.2013.6702234
Autor:
David Ruffieux, G. Allegato, T. Suni, Frederic Giroud, F. Staub, J. Dekker, K. Zoschke, Nicola Scolari, C. A. Manier, H. Oppermann, Thanh-Chau Le, Silvio Dalla Piazza
Publikováno v:
ISSCC
Ruffieux, D, Scolari, N, Giroud, F, Le, T-C, Dalla Piazza, S, Staub, F, Zoschke, K, Manier, C-A, Oppermann, H, Suni, T, Dekker, J & Allegato, G 2014, ' A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks ', IEEE Journal of Solid-State Circuits, vol. 49, no. 1, pp. 212-222 . https://doi.org/10.1109/JSSC.2013.2282111
Ruffieux, D, Scolari, N, Giroud, F, Le, T C, Piazza, S D, Staub, F, Zoschke, K, Manier, C A, Oppermann, H, Dekker, J, Suni, T & Allegato, G 2013, A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks . in Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013 . IEEE Institute of Electrical and Electronic Engineers, Digest of Technical Papers-IEEE International Solid-State Circuits Conference, pp. 196-197, 60th IEEE International Solid-State Circuits Conference, ISSCC 2013, San Francisco, CA, United States, 17/02/13 . https://doi.org/10.1109/ISSCC.2013.6487697
Ruffieux, D, Scolari, N, Giroud, F, Le, T-C, Dalla Piazza, S, Staub, F, Zoschke, K, Manier, C-A, Oppermann, H, Suni, T, Dekker, J & Allegato, G 2014, ' A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks ', IEEE Journal of Solid-State Circuits, vol. 49, no. 1, pp. 212-222 . https://doi.org/10.1109/JSSC.2013.2282111
Ruffieux, D, Scolari, N, Giroud, F, Le, T C, Piazza, S D, Staub, F, Zoschke, K, Manier, C A, Oppermann, H, Dekker, J, Suni, T & Allegato, G 2013, A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks . in Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013 . IEEE Institute of Electrical and Electronic Engineers, Digest of Technical Papers-IEEE International Solid-State Circuits Conference, pp. 196-197, 60th IEEE International Solid-State Circuits Conference, ISSCC 2013, San Francisco, CA, United States, 17/02/13 . https://doi.org/10.1109/ISSCC.2013.6487697
This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::afe81748b933b58fe52439f539a4ef6c
https://cris.vtt.fi/en/publications/b63b91dd-a85e-47ca-922d-d0ef77a7b950
https://cris.vtt.fi/en/publications/b63b91dd-a85e-47ca-922d-d0ef77a7b950
Publikováno v:
WIT Transactions on The Built Environment.
Nowadays, diamond-like carbon (DLC) coatings are mainly used in many low loaded applications such as in machine tools, computer devices and many more. Especially the automotive industry anticipates a benefit in applying such coatings in association w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce677b9e3fe6c618ee197f2a70be56e8
https://doi.org/10.2495/hpsm100481
https://doi.org/10.2495/hpsm100481
Publikováno v:
Tribology of Diamond-Like Carbon Films ISBN: 9780387302645
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e39222db1b8e3f5edf638144bd9ef01e
https://doi.org/10.1007/978-0-387-49891-1_15
https://doi.org/10.1007/978-0-387-49891-1_15