Výsledky vyhledávání - "C. van 't Hof"

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Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

Autor: H.J.L. Bressers, A. W. J. den Boer, J. Janssen, L.J. Ernst, J.F.J.M. Caers, Guoqi Zhang, C. van 't Hof, M.S. Kiasat, Daoguo Yang

Publikováno v: Journal of Electronic Packaging. 124:97-105

Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations,

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e68bda9d5c66b5acf8465c3483295fa1
https://doi.org/10.1115/1.1459471

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Vertical die crack stresses of Flip Chip induced in major package assembly processes

Autor: F. Kuper, J. Bisschop, R. Schravendeel, Z. N. Liang, J. Janssen, M.S. Kiasat, L.J. Ernst, C. van 't Hof, Guoqi Zhang, Daoguo Yang

Publikováno v: Microelectronics Reliability. 40:1533-1538

This paper focuses on the FEM prediction of vertical die crack stresses in a Flip Chip configuration, induced in the major package assembly processes and subsequent thermo-mechanical loading. An extended Maxwell model is used to describe the time dep

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4b23d78f18134485973ea888a945840c
https://doi.org/10.1016/s0026-2714(00)00156-6

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Polymer Materials Characterization, Modeling and Application

Autor: L.J. Ernst, Guoqi Zhang, Daoguo Yang, J.H.J. Janssen, C. van 't Hof, H. J. L. Bressers, Kaspar M. B. Jansen

Publikováno v: Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ISBN: 9780387279749

In computational prototyping of electronic packages an appropriate description of the mechanical behavior of polymers being included is required. An overview of presently available material models is presented. In particular a cure dependent linear-v

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::deb8406b223ac2ec3e90e4c3af4ad594
https://doi.org/10.1007/0-387-32989-7_1

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Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

Autor: L.J. Ernst, C. van 't Hof, Guoqi Zhang, M. Saraswat, Daoguo Yang, H. J. L. Bressers, Kaspar M. B. Jansen

Publikováno v: 2006 7th International Conference on Electronic Packaging Technology.

In order to establish the possible influence of residual stress-and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::31d46dbb8c2c30134d6ae09807305640
https://doi.org/10.1109/icept.2006.359808

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Cure, temperature and time dependent constitutive modeling of moulding compounds

Autor: K.M.B. Jansen, C. van 't Hof, H. J. L. Bressers, Guoqi Zhang, Liliang Wang, L.J. Ernst

Publikováno v: 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Moulding compounds are used as encapsulation materials for electronic components. Their task is to protect the components from mechanical shocks and environmental effects such as moisture. Moulding compounds are epoxy resins filled with inorganic (si

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::089c5d97e8056d2b7b4f6c41c4b47dad
https://doi.org/10.1109/esime.2004.1304095

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A novel tool for cure dependent viscoelastic characterization of packaging polymers

Autor: Kaspar M. B. Jansen, C. van 't Hof, Guoqi Zhang, L.J. Ernst, H. J. L. Bressers, Daoguo Yang, G. Wisse

Publikováno v: 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

This paper concerns the dynamic mechanical shear characterization of curing thermosets. During curing, thermosets change from a viscous liquid to a viscoelastic solid. This solidification process is attended by chemical shrinkage, a combination leadi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d31bc23f49101cb90989d02b28d78b20
https://doi.org/10.1109/esime.2004.1304068

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