Zobrazeno 1 - 10
of 11
pro vyhledávání: '"C. W. Jurgensen"'
Autor:
R. R. Kola, G. R. Weber, Anthony E. Novembre, Lee Edward Trimble, George K. Celler, C. W. Jurgensen, J. Frackoviak
Publikováno v:
Applied Physics Letters. 59:3105-3107
We have constructed monolithic masks for proximity x‐ray lithography by forming 1 μm thick polycrystalline Si membranes directly on glass support frames. Finished masks are 78 mm in diameter and ∼5 mm thick, with the Si membrane spanning 27 mm.
Autor:
Steven D. Berger, James Alexander Liddle, L. Fetter, R. G. Tarascon, R. M. Camarda, C. W. Jurgensen, J. S. Kraus, H. A. Huggins, Reginald C. Farrow, R. R. Kola
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:2175
This article discusses the relevant criteria for selecting alignment marks for projection electron lithography. The mark material, topography, and pattern layout are considered. Results from experiments and calculations indicate that there is a wide
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:2542
We describe the first commercial etching system based on a helicon ion source and characterize it for etching organic films in an oxygen plasma. This single wafer etching system achieves a throughput of at least 30 fully processed 5 in. wafers per ho
Autor:
James Alexander Liddle, R. R. Kola, R. M. Camarda, L. Fetter, Reginald C. Farrow, H. A. Huggins, J. S. Kraus, C. W. Jurgensen, Steven D. Berger
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:2780
The design considerations and performance requirements of an alignment and registration method for high‐throughput projection electron lithography are discussed. We have devised a mark detection system for a lithography tool employing the SCALPEL p
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:2133
As we enter the era of ultra‐large‐scale integrated circuit manufacture, plasma etching grows more important for fabricating structures with unprecedented dimensions. For feature sizes below 1 μm and aspect ratios (depth/width) much larger than
Autor:
Steven D. Berger, C. W. Jurgensen, R. R. Kola, James Alexander Liddle, J. M. Gibson, H. A. Huggins, G. R. Weber
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 9:3000
The choice of mask materials and fabrication route for a projection electron‐beam lithography system is subject to a variety of constraints. Some are encountered in most lithographic techniques, while some are unique to the scattering with regular
Autor:
C. W. Jurgensen
Publikováno v:
Journal of Applied Physics. 64:590-597
The effect of sheath collision processes on the energy and directionality of surface bombardment in reactive ion etching is modeled. Although the methods used are generally applicable, all the numerical examples are for a low‐pressure high‐freque
Publikováno v:
The Journal of Chemical Physics. 84:649-653
The electronic spectra of TCNQ and TCNQ complexes has been investigated at high pressure up to 150 kbar. The observed pressure shifts are discussed in terms of intermolecular interactions. The results are also compared with available theoretical calc
Publikováno v:
The Journal of Chemical Physics. 83:6108-6112
The visible and infrared spectra of the 1 : 1 and 2 : 1 solid‐state complexes of hexamethylbenzene with tetracyanoethylene were investigated as a function of pressure up to 100 kbar. The degree of charge transfer is estimated as a function of press
Publikováno v:
Chemischer Informationsdienst. 17