Packaging for medical and wellness applications

Autor: M. Cartier, A. Rouzaud, J-C. Souriau, Gilles Simon, Jean Brun, G. Pares

Publikováno v: International Symposium on Microelectronics. 2016:000139-000143

Wellness and medical area are today identified among the next big markets, and the associated roadmaps show a global trend from the benchtop to portable devices then to longer term wearable and implantable devices. For these last devices new packagin

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::78739b1a7139a09234fd974cf0d28533
https://doi.org/10.4071/isom-2016-wa11

A Versatile Platform towards High Reliability Compact Package for Digital Chips

Autor: L. Toffanin, J-P. Peltier, G. Simon, V. Puyal, B. Kholti, J-C. Souriau, C. Ferrandon, L. Castagne, G. Waltener, R. Lemaire, T. Lacrevaz

Publikováno v: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), May 2017, Orlando, United States. pp.623-630, ⟨10.1109/ECTC.2017.331⟩

A technological multi-chip module with a large silicon interposer has been designed, manufactured and characterized for space and airborne applications. It stands for a reconfigurable advanced calculation device, for up to 10 Gbps data rate. The elec

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2c192e968cd954cf953dca17d64c83db
https://hal.science/hal-02017756

Detection of new variants in the apolipoprotein B (Apo B) gene by PCR-SSCP

Autor: Gérard Roizès, Isabelle Behague, Gérald Luc, Dominique Arveiler, F. Cambien, Alun Evans, Pedro Marques-Vidal, Odette Poirier, C. Souriau, Sylvain Ricard

Publikováno v: Human Mutation. 8:282-285

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::580990d5f72ea1c8bdfca6623bdb9780
https://doi.org/10.1002/(sici)1098-1004(1996)8:3<282::aid-humu16>3.0.co

Wafer Level Processing on Re-built Wafer for Chip Staking

Autor: M. Charrier, O. Lignier, J.-C. Souriau, G. Poupon, C. Val

Publikováno v: Scopus-Elsevier

Chip stacking has emerged as the best solution to reduce the packaging size (Karnezos, 2004). Several approaches are proposed by companies and laboratories and each of them presents specific advantages and drawbacks (Tummala, 2004). Today, major 3D a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::787fefda29ba007886ab5c4845c4c50f
https://doi.org/10.1109/eptc.2005.1614382

Electrical conductive film for Flip-Chip Interconnection based on Z-axis conductors

Autor: G. Poupon, Cyrille Rossat, J.-C. Souriau, Adrien Gasse, P. Renard

Publikováno v: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

The development of new Anisotropic Conductive Film for high density Flip-Chip Interconnection has met with growing interest over the last few years. ACF provides promising solutions for bumpless chip connection to high density printed circuit board.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5aa061d3a6b7e5d881767a4d98f7e06d
https://doi.org/10.1109/ectc.2002.1008249