Zobrazeno 1 - 10
of 53
pro vyhledávání: '"C. Robert Kao"'
Publikováno v:
Advanced Intelligent Systems, Vol 2, Iss 8, Pp n/a-n/a (2020)
Fluidic elastomer actuators (FEAs) are popular actuation ways in soft robotics due to their low cost and simple fabrication process. To realize intelligent soft robotic systems, real‐time monitoring of their deformation and interactions with surrou
Externí odkaz:
https://doaj.org/article/1f59204363a944e6a7ec6b60bca548a2
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f437c37ad01b5d5941b97cc2dc260f3
https://doi.org/10.23919/icep58572.2023.10129697
https://doi.org/10.23919/icep58572.2023.10129697
Autor:
Yung-Sheng Lin, Yun-Ching Hung, Chin-Li Kao, Chung-Hung Lai, Po-Shao Shih, Jeng-Hau Huang, David Tarng, C. Robert Kao
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5c4d93a8190cd73b31fd93e7b096a4d
https://doi.org/10.1109/ectc51906.2022.00038
https://doi.org/10.1109/ectc51906.2022.00038
Autor:
YiWun Wang, C. Robert Kao
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The development of solder is from Pb-bearing to Pb-free solder because of toxin. Nowadays, Sn-based solder is usually chosen as the prime materials in electronic packaging. However, the melting point of Sn-based solder is higher than Pb-bearing solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eec4352b65a0a7bf02e9577bed9c7362
https://doi.org/10.1109/estc48849.2020.9229849
https://doi.org/10.1109/estc48849.2020.9229849
Autor:
Hiroshi Nishikawa, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Chin-Hao Tsai, C. Robert Kao
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Over the past decades, the demands for high temperature power electronics for automotive applications increased continuously. Inverters and converters in power integrated circuit modules dominate both energy conversion efficiency and performance in e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45a1fb1135c08e9a3189a9e50e44457f
https://doi.org/10.1109/ectc32862.2020.00226
https://doi.org/10.1109/ectc32862.2020.00226
Autor:
C. Robert Kao, Yi-Wun Wang
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Process temperature must be reduced to avoid the reliability degradation of 3D IC packages due to thermal damage of temperature-sensitive devices. Low-temperature bonding avoids thermal damages and bonding misalignment. Owing to the ban of lead, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::591773d77c49950c40f5511005b8d99b
https://doi.org/10.1109/eptc47984.2019.9026712
https://doi.org/10.1109/eptc47984.2019.9026712
Publikováno v:
Intermetallics. 138:107342
Three-dimensional integrated circuits provide a promising approach to extend Moore's law by vertically stacking multiple functional chips with microbumps. However, with miniaturization, depletion of the wetting layer of under bump metallurgy becomes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73fe555b1ffabdd19d18631a990455e2
https://doi.org/10.1016/j.intermet.2021.107342
https://doi.org/10.1016/j.intermet.2021.107342
Publikováno v:
Langmuir. 33:8413-8419
The evolution of surface chemical structures of polyimide induced by Ar fast atom beam (Ar-FAB) bombardment and vacuum ultraviolet (VUV) irradiation was investigated using X-ray photoelectron spectroscopy (XPS) to clarify the activated sites for low-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0d3470eba435df066696ad7201e74a0
https://doi.org/10.1021/acs.langmuir.7b02010
https://doi.org/10.1021/acs.langmuir.7b02010
Publikováno v:
3DIC
In this study, a heterogeneous bonding between organic and inorganic materials was realized at low temperature without vacuum atmosphere, by means of the vapor-assisted vacuum ultraviolet (VUV) surface modification method. In this method, an ultrathi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39d9675d55a795c7b0da96c95b2c7de6
https://doi.org/10.1109/3dic48104.2019.9058786
https://doi.org/10.1109/3dic48104.2019.9058786
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Thermocompression bonding (TCB) process is now being adopted for high density interconnections but the necessity of applying force and heat causes a lot of problems, such as warpage-induced defects, cracking of delicate chips and thermal drift. To ad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb9de58be7aab8bce36a75df6b6decec
https://doi.org/10.1109/ectc.2019.00265
https://doi.org/10.1109/ectc.2019.00265