Zobrazeno 1 - 10
of 212
pro vyhledávání: '"C. Ramya"'
Autor:
R. B. Namasivaya Navin, K. Gowthame, Balaji Dhanasekaran, S. Prabakaran, S. Rajasekaran, B. Sarath Kumar, C. Ramya Shree, S. R. Karthika
Publikováno v:
The Egyptian Journal of Otolaryngology, Vol 39, Iss 1, Pp 1-6 (2023)
Abstract Background The tympanic membrane (TM) forms the partition between the external auditory canal and the middle ear. Perforations occur as a result of acute otitis media or traumatic causes which undergoes healing spontaneously over 3 to 4 week
Externí odkaz:
https://doaj.org/article/729d13ee9aa240c0935eb18f1b714876
Manual classification of IT service desk tickets may result in routing of the tickets to the wrong resolution group. Incorrect assignment of IT service desk tickets leads to reassignment of tickets, unnecessary resource utilization and delays the res
Externí odkaz:
http://arxiv.org/abs/2103.15822
Autor:
C, Ramya, S, Shreedhara K
In the world of the Internet and World Wide Web, which offers a tremendous amount of information, an increasing emphasis is being given to searching services and functionality. Currently, a majority of web portals offer their searching utilities, be
Externí odkaz:
http://arxiv.org/abs/2103.14371
Publikováno v:
European Journal of Cardiovascular Medicine. 2023, Vol. 13 Issue 4, p475-480. 6p.
Autor:
C. Ramya, Raghavendra Rao, B.V.
Publikováno v:
In Theoretical Computer Science 24 February 2020 809:1-20
Publikováno v:
MRIMS Journal of Health Sciences, Vol 9, Iss 4, Pp 169-173 (2021)
Background: Anemia is one of the most common health problems prevalent in Third World countries and developed countries. Anemia among children is of the most important public health problems as it is associated with overall growth and performance of
Externí odkaz:
https://doaj.org/article/2fc9e959e86b4a8ca7d964417bdf5a19
Publikováno v:
Journal of Tropical Agriculture. 2023, Vol. 61 Issue 1, p1-7. 7p.
Autor:
C., Ramya Menon, Pangracious, Vinod
Besides the lot of advantages offered by the 3D stacking of devices in an integrated circuit there is a chance of device damage due to rise in peak temperature value. Hence, in order to make use of all the potential benefits of the vertical stacking
Externí odkaz:
http://arxiv.org/abs/1203.1799
Autor:
C., Ramya Menon, Pangracious, Vinod
Publikováno v:
VLSICS, International Journal of VLSI Design & Communication Systems, Vol 2, Num 4 (2011) 155-165
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis methodology t
Externí odkaz:
http://arxiv.org/abs/1201.3332
Publikováno v:
International Journal of Research Publication and Reviews. 4:1811-1814
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2e87975d456367b45e91f30658d898f
https://doi.org/10.55248/gengpi.2023.4.4.35768
https://doi.org/10.55248/gengpi.2023.4.4.35768