Application of Thermal Analysis to Evaluation of Semiconductor Encapsulation

Autor: W. L. Hunter, Kim Ritchie, C. Malkiewicz

Publikováno v: Thermal Analysis ISBN: 9783034857772

Encapsulation of semiconductors in plastic has introduced many problems. Economical manufacture of reliable plastic-encapsulated semiconductors requires evaluation and control of (i) the uniformity of parts from different mold cavities, (ii) the coef

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::84ee196b924cf5928f7e358e265ff233
https://doi.org/10.1007/978-3-0348-5775-8_15

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Polymers in Electronics

Autor: THEODORE DAVIDSON, J. V. CRIVELLO, HIROSHI ITO, C. GRANT WILLSON, R. D. MILLER, D. R. MCKEAN, T. L. TOMPKINS, N. CLECAK, J. MICHL, J. DOWNING, W. T. BABIE, M-F. CHOW, W. M. MOREAU, H. HIRAOKA, L. W. WELSH, C. C. WALKER, J. N. HELBERT, A. C. OUANO, M. A. SCHMIDT, C. MALKIEWICZ, E. WALLACE, C. U. PITTMAN, TOSHIAKI TAMAMURA, SABURO IMAMURA, SHUNGO SUGAWARA, C. C. ANDERSON, P. D. KRASICKY, F. RODRIGUEZ, Y. NAMASTE, S. K. OBENDORF, B. BEDNÁŘ, J. DEVÁTÝ, J. KRÁLÍČEK, J. ZACHOVAL, M. J. BOWDEN, D. L. ALLARA, W. I. VROOM, J. FRACKOVIAK, L. C. KELLEY, D. R. FALCONE, T. N. BOWMER, HIROSHI SHIRAISHI, ASAO ISOBE, FUMIO MURAI, SABURO NONOGAKI, KATSUMI TANIGAKI, YOSHITAKE OHNISHI, SHOZO FUJIWARA, AKIHIRO FURUTA, JUEY H. LAI, P. METZGER COTTS, W. VOLKSEN, J. DURAN, N. S. VISWANATHAN, GARY C. DAVIS, WINSTON C. MIH, CHING-PING WONG, K. B. WISCHMANN, F. W. AINGER, J. BRETTLE, I. DIX, M. T. GOOSEY, R. D. SMALL, J. A. ORS, B. S. H. ROYCE, J. B. ENNS, NEIL S. FOX, C. R. MORGAN, D. R. KYLE, R. W. BUSH, Z. N. SANJANA, R. S. RAGHAVA, J. R. MARCHETTI, P. PANTELIS, LESLEY J. GOLDSTEI