Zobrazeno 1 - 3
of 3
pro vyhledávání: '"C. M. Nagaraj"'
Publikováno v:
Journal of Electronic Materials. 38:2735-2745
Because of their very high thermal conductivity, low melting point, and high shear compliance, indium-based materials are excellent candidates for thermal interface material (TIM) applications for packaging thermally sensitive next-generation devices
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b002fedf4b4e51cf8362c34e65d6e1b4
https://doi.org/10.1007/s11664-009-0898-9
https://doi.org/10.1007/s11664-009-0898-9
Autor:
Praveen Kumar, M. Renavikar, C. M. Nagaraj, Indranath Dutta, Ravi Mahajan, Jia Liu, Rishi Raj
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.
In this study, a novel architecture composed of uniformly distributed high melting phase (HMP, e.g. Cu) in a low melting phase (LMP, e.g. In) matrix, which can be produced via liquid phase sintering (LPS), is proposed to produce next generation therm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b1f41c1bd0d9ec56960f4afeb0be0b6
https://doi.org/10.1115/ipack2011-52221
https://doi.org/10.1115/ipack2011-52221
Publikováno v:
ACS Omega, Vol 4, Iss 1, Pp 1354-1363 (2019)
Externí odkaz:
https://doaj.org/article/dfa2f5bd7f5b4d88b48a9116bea2256b