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Flip Chip Bonded Optoelectronic Devices on Ultra-Thin Silicon-on-Sapphire for Parallel Optical Links
Autor:
M. Pendleton, Donald J. Albares, M. Wong, J. Cable, R. Athale, Ronald E. Reedy, C. Kunzia, J. Green
Publikováno v:
Optics in Computing.
We describe flip chip bonding of arrayed optoelectronic devices (VCSELs, MSM and PIN detectors) onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 2.5 Gbps (and higher) parallel optical links
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f6f475f3de3eea1af84b2c0666e2f05
https://doi.org/10.1364/oc.2001.otha7
https://doi.org/10.1364/oc.2001.otha7
