Thermal management of electronic devices by composite materials integrated in silicon

Autor: Nathalie Rolland, C. Kinkelin, Malek Zegaoui, Sandrine Lhostis, Frédéric Lefèvre, Y. Kaplan, Emmanuel Ollier, B. Descouts, H. Le Poche, Stéphane Lips, Pascal Ancey, V. Remondière, A.L. Seiler, Paul-Alain Rolland, U. Soupremanien, Jean Dijon

Publikováno v: Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2014, 127, pp.28-33. ⟨10.1016/j.mee.2014.03.016⟩
Microelectronic Engineering, 2014, 127, pp.28-33. ⟨10.1016/j.mee.2014.03.016⟩

As the power of electronic systems is increasing, thermal fluxes are getting higher, up to more than 100 W/cm 2 in the more critical cases. They result in hot spots with various consequences, especially performance reduction and reliability issues. M

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eeefcb53afb5ba5772dea62471816546
https://doi.org/10.1016/j.mee.2014.03.016

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