Zobrazeno 1 - 10
of 49
pro vyhledávání: '"C. Gaumer"'
Autor:
J. Kanyandekwe, D. Barge, P. Morin, L. Grenouillet, M. Labrot, S. Maitrejean, E. Augendre, V. Lapras, Y. Morand, D. Dutartre, M. Gros-Jean, O. Gourhant, C. Gaumer, N. Rambal, D. Cooper, L. Clement
Publikováno v:
Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials.
Autor:
F. Abbate, E Baylac, Clement Pribat, D. Barge, Marc Juhel, C. Gaumer, A. Pofelski, Vincent Mazzocchi, Germain Serventon, Olivier Gourhant, Francois Andrieu, Maud Bidaud
Publikováno v:
ECS Transactions. 64:469-478
High mobility channels are considered as an interesting path to increase PMOS performances for advanced CMOS technology. Silicon-Germanium On Insulator (SGOI) benefits from both the advantage of the SiGe material (hole mobility booster) and the On In
Autor:
Jean-Francois Nodin, Philippe Candelier, C. Gaumer, Vincent Jousseaume, Jacques Cluzel, Barbara De Salvo, Elise Le-Roux, Carlo Cagli, Mickael Gros-Jean, C. Carabasse, T. Diokh, S. Jeannot, M. Mellier
Publikováno v:
Thin Solid Films. 533:24-28
In this work, cells based on TiN/TaO x /TiN metal–insulator–metal structure, fabricated in a 65 nm complementary metal oxide semiconductor technology, are investigated in order to propose a good stack candidate for multiple time programmable (MTP
Autor:
Julien Buckley, S. Jeannot, C. Mannequin, Patrice Gonon, Mickael Gros-Jean, Anne-Claire Salaün, H. Grampeix, C. Vallée, C. Gaumer, Vincent Jousseaume
Publikováno v:
Thin Solid Films. 525:20-27
This work is focused on the investigation of Au/high k/TiN stacks for Resistive Random Access Memories. A screening of high k oxides, commonly used in advanced metal gates, such as HfO2 and ZrO2, is proposed. These oxides were grown on TiN electrodes
Autor:
Fausto Sirotti, Olivier Renault, Sandrine Lhostis, Eugénie Martinez, Mathieu G. Silly, C. Gaumer, Christophe Licitra
Publikováno v:
Applied Surface Science. 258:2107-2112
The impact of HfO:N post nitridation anneal (PNA) and gate fabrication on the physico-chemical properties of the TiN/HfO:N/SiO 2 /Si stack are investigated using Soft X-ray Photoelectron Spectroscopy (S-XPS) and Vacuum UltraViolet Spectroscopic Ellip
Autor:
P. Ruault, Gong Bo, O. Hinsinger, B. van Schravendijk, D. Winandy, C. Fenouillet-Beranger, D. Galpin, D. Vo-Thanh, S. Lagrasta, Romain Duru, Remi Beneyton, C. Gaumer, J. Mazurier, S. Chhun, N. Chauvet, Bhadri N. Varadarajan, D. Barge, P. Meijer, N. Sun, Daniel Benoit
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM)
For the first time, the interest of a new SiCO low-k spacer material deposited at 400°C is evaluated in the perspective of a 3D VLSI integration. The benefits of SiCO low-k (4.5 vs 7 for SiN) value is preserved throughout the whole integration and t
Autor:
Fabien Boulanger, M. Casse, Laurent Brunet, Francois Andrieu, C. Gaumer, Olivier Weber, Xavier Garros, Gilles Reimbold, D. Lafond
Publikováno v:
ECS Transactions. 35:515-530
The paper investigates the stability of the transistor threshold voltage VT with scaling in 30nm High-K/Metal Gate technology. For HfO2 and HfZrO oxides, large VT instability, up to 230mV, is seen when the device width (W) is scaled down to 80nm. It
Autor:
François Bertin, Eugénie Martinez, C. Gaumer, Christophe Licitra, Jean-Paul Barnes, Névine Rochat, Sandrine Lhostis, M. J. Guittet, Mickael Gros-Jean, Amal Chabli, Nicholas Barrett
Publikováno v:
Microelectronic Engineering. 88:72-75
The impact of the deposition of a TiN electrode on the high-k oxide HfO"2 has been investigated, focussing on the dielectric band gap. After the gate elaboration, a non-destructive approach combining Spectroscopic Ellipsometry (SE), Reflection Electr
Autor:
Mathieu Charbonnier, N. Benedetto, F. Fillot, C. Guedj, C. Gaumer, Eugénie Martinez, Sandrine Lhostis, Christophe Licitra, Charles Leroux
Publikováno v:
ECS Transactions. 16:161-169
In this paper, we investigate the impact of thermal budget and HfO 2 thickness on the chemical and electronic properties of the HfO 2 /SiO 2 /S' stack. High temperature anneal at 750°C induces both the regrowth and reoxidation of the SiO 2 interfaci
Autor:
Jean-Marc Fabbri, Claudia Wiemer, Dominique Lafond, C. Gaumer, Sandrine Lhostis, Michele Perego, Eugénie Martinez, Virginie Loup
Publikováno v:
214th Meeting of the Electrochemical-Society, pp. 99–110, Honolulu, OCT 13-15, 2008
info:cnr-pdr/source/autori:C. Gaumer, E. Martinez, S. Lhostis, C. Wiemer, M. Perego, V. Loup, D. Lafond, J.-M. Fabbri/congresso_nome:214th Meeting of the Electrochemical-Society/congresso_luogo:Honolulu/congresso_data:OCT 13-15, 2008/anno:2008/pagina_da:99/pagina_a:110/intervallo_pagine:99–110
info:cnr-pdr/source/autori:C. Gaumer, E. Martinez, S. Lhostis, C. Wiemer, M. Perego, V. Loup, D. Lafond, J.-M. Fabbri/congresso_nome:214th Meeting of the Electrochemical-Society/congresso_luogo:Honolulu/congresso_data:OCT 13-15, 2008/anno:2008/pagina_da:99/pagina_a:110/intervallo_pagine:99–110
In this work, we investigate the crystalline structure and the chemical properties of a "metal / high-k" gate stack with TaN as the gate electrode and HfO(2) as the dielectric. We show that a 3nm-thick layer of HfO(2) is crystallized when it is integ