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Straightforward measurement of anisotropic thermal properties of a Bi

Autor: D, Fournier, M, Marangolo, M, Eddrief, N N, Kolesnikov, C, Fretigny

Publikováno v: Journal of physics. Condensed matter : an Institute of Physics journal. 30(11)

We demonstrate here a simple measurement protocol which allows the thermal properties of anisotropic crystalline materials to be determined. This protocol is validated by the measurement of Bi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=pmid________::eb36d88bbc164ecb39e1da9502d76a83
https://pubmed.ncbi.nlm.nih.gov/29469058

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Akademický článek

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Lateral heat diffusion in layered structures: Theory and photothermal experiments

Autor: C. Fretigny, D. Fournier

Publikováno v: The European Physical Journal Special Topics. 153:69-73

It is very important to understand how the heat diffuses in the case of nano objects and of layered structures. We will demonstrate that the lateral diffusion could be very different in the case of a good conductor layer deposited on a bad one and fo

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::32d10d8d1b7a2bcf8fdfa238e5328a9d
https://doi.org/10.1140/epjst/e2008-00395-6

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Solution for the elastic field in a layered medium under axisymmetric contact loading

Autor: Antoine Chateauminois, C Fretigny

Publikováno v: Journal of Physics D: Applied Physics. 40:5418-5426

This study addresses the problem of the calculation of the elastic stress and displacement field within isotropic layered media in frictionless contact with rigid axisymmetric indenters. For a prescribed surface stress distribution, the integral tran

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cb2d970262c6dc11f74ef145739546eb
https://doi.org/10.1088/0022-3727/40/18/s02

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Akademický článek

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Red blood cells imaging and antigen–antibody interaction measurement

Autor: Ahmed Touhami, Oussama Ouerghi, C Fretigny, Ali Othmane, H. Ben Ouada, N Jaffrezic-Renault

Publikováno v: Biomolecular Engineering. 19:189-193

In the present study the atomic force microscope (AFM) was used to image the surface morphology of red blood cells (RBC) for the first time. The AFM yielded very reproducible images without appreciable modifications of the sample surfaces. In additio

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7b87a5f11aa240366557d7c2a85503e4
https://doi.org/10.1016/s1389-0344(02)00045-x

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Investigating specific antigen/antibody binding with the atomic force microscope

Autor: C Fretigny, Ahmed Touhami, Oussama Ouerghi, Ali Othmane, Nicole Jaffrezic-Renault, H. Ben Ouada, Claude Martelet

Publikováno v: Biomolecular Engineering. 19:183-188

The aim of this work is to detect immune complexes without any kind of labelling of each of the immunological species, with a view to create a very sensitive biosensor. This is achieved by using the atomic force microscopy. We have proceeded by imagi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cef49965f53037421fdf9eb4be3b1146
https://doi.org/10.1016/s1389-0344(02)00046-1

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Investigating antibody–antigen binding with atomic force microscopy

Autor: Oussama Ouerghi, Ahmed Touhami, Nicole Jaffrezic-Renault, C Fretigny, Claude Martelet, Ali Othmane, H. Ben Ouada

Publikováno v: Sensors and Actuators B: Chemical. 84:167-175

Adhesive interactions between antigen–antibody play a central role in immune system operation. The objective of this paper is to detect immune complexes without any label, by using atomic force microscopy (AFM). We have proceeded by imaging antibod

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::36d5f7115c2799b092f06ac3792f8972
https://doi.org/10.1016/s0925-4005(02)00020-5

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High density chip-to-wafer integration using self-assembly: On the performances of directly interconnected structures made by direct copper/oxyde bonding

Autor: P. Coudrain, Sébastien Mermoz, C. Fretigny, L. Di Cioccio, L. Sanchez, E. Deloffre, Jean Berthier

Publikováno v: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

We present here our latest results on chips-to-wafer 3D structures obtained with the self-assembly technology adapted on copper/oxide patterned surfaces. Technological integration, bonding quality and alignment accuracy are presented and the electric

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::83e1e250c79e6f0ec198fb098ba02643
https://doi.org/10.1109/eptc.2013.6745705

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