3DVLSI with CoolCube process: An alternative path to scaling

Autor: Maud Vinet, Thomas Signamarcheix, V. Lu, Julie Widiez, Fabien Clermidy, A. Royer, J. Mazurier, M.-P. Samson, F. Piegas-Luce, Fabrice Nemouchi, L. Pasini, J.M. Hartmann, M. Casse, F. Deprat, Laurent Brunet, N. Rambal, Maurice Rivoire, Perceval Coudrain, M. Bidaud, Ogun Turkyilmaz, Hossam Sarhan, F. Ponthenier, G. Ghibaudo, C. Euvard-Colnat, Perrine Batude, Louis Hutin, Sebastien Kerdiles, Claude Tabone, Emmanuel Josse, L. Benaissa, E. Petitprez, Remi Beneyton, Claire Fenouillet-Beranger, L. Hortemel, G. Cibrario, Pascal Besson, A. Seignard, B. Mathieu, F. Fournel, C. Bout, C. Agraffeil, S. Sollier, Michel Haond, O. Billoint, P. Leduc, O. Rozeau, Benoit Sklenard, Sebastien Thuries, Bernard Previtali, O. Faynot

Publikováno v: 2015 VLSI-Technology Technical Digest
2015 IEEE Symposium on VLSI Technology
2015 IEEE Symposium on VLSI Technology, Jun 2015, Kyoto, Japan. pp.T48-T49, ⟨10.1109/VLSIT.2015.7223698⟩

session 5: 3D Systems and Packaging; International audience; 3D VLSI with a CoolCube™ integration allows vertically stacking several layers of devices with a unique connecting via density above a million/mm 2 . This results in increased density wit

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3c2ded39939fef69ac4246deba1297f1
https://hal.archives-ouvertes.fr/hal-02049760

Thermal sensors cointegrated within a MEMS thermally actuated ultrathin membrane

Autor: P. Morfouli, J Guillen, L. Montès, R. Lefevre, C. Dehan, C Agraffeil, A. Salette

Publikováno v: Journal of Micromechanics and Microengineering. 22:065029

This paper reports the simulation, design, fabrication and characterization of thermal sensors integrated into an ultrathin active MEMS membrane. Temperature detection is combined without any additional fabrication steps to thermal actuation. Mixing

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0b9c61f1b61d5dacf19d4ce91696e90d
https://doi.org/10.1088/0960-1317/22/6/065029

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CMOS compatible strategy based on selective atomic layer deposition of a hard mask for transferring block copolymer lithography patterns.

Autor: G Gay, T Baron, C Agraffeil, B Salhi, T Chevolleau, G Cunge, H Grampeix, H Tortai, F Martin, E Jalaguier, B De Salvo

Publikováno v: Nanotechnology; Oct2010, Vol. 21 Issue 43, p435301-435301, 1p

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