Výsledky vyhledávání - "Côme de Buttet"

Deep Trenches Cleanliness Challenges for CMOS Image Sensors

Autor: Côme de Buttet, Franck Dignat, Philippe Garnier

Publikováno v: ECS Transactions. 80:101-109

Deep trenches are widely used, either as capacitors in memories, or as electrical / optical isolation between two transistors or pixels in CMOS integrated circuits or CIS(CMOS Image sensors). Therefore, their isolation quality depends on their cleanl

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08d1c1d43d36b517111dc3aa6af6e46e
https://doi.org/10.1149/08002.0101ecst

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Overview of several applications of chemical downstream etching (CDE) for IC manufacturing: advantages and drawbacks versus WET processes

Autor: Sonarith Chhun, Laurent Vallier, Alain Campo, Gilles Cunge, Côme de Buttet, Philippe Garnier, S. Zoll, Emilie Prevost, Thomas Massin, Patrick Maury

Publikováno v: SPIE Proceedings.

Today the IC manufacturing faces lots of problematics linked to the continuous down scaling of printed structures. Some of those issues are related to wet processing, which are often used in the IC manufacturing flow for wafer cleaning, material etch

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::261ab2cd95fd4103d27f92bd846b003a
https://doi.org/10.1117/12.2257971

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