Zobrazeno 1 - 3
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pro vyhledávání: '"Côme de Buttet"'
Autor:
Sonarith Chhun, Laurent Vallier, Alain Campo, Gilles Cunge, Côme de Buttet, Philippe Garnier, S. Zoll, Emilie Prevost, Thomas Massin, Patrick Maury
Publikováno v:
SPIE Proceedings.
Today the IC manufacturing faces lots of problematics linked to the continuous down scaling of printed structures. Some of those issues are related to wet processing, which are often used in the IC manufacturing flow for wafer cleaning, material etch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::261ab2cd95fd4103d27f92bd846b003a
https://doi.org/10.1117/12.2257971
https://doi.org/10.1117/12.2257971
Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2023)Selected peer-reviewed full text papers from the 16th International Symposium on Ultra Clean Processing of S