Zobrazeno 1 - 10
of 32
pro vyhledávání: '"C, Cognetti"'
Importance: This analysis provides long-term follow-up in patients with BRAF wild-type advanced melanoma receiving first-line therapy based on anti-programmed cell death 1 receptor inhibitors. Objective: To compare the 3-year survival with nivolumab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::5f1610337ac157fc232883d78410afa9
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3077367
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3077367
BACKGROUND: Nivolumab was associated with higher rates of objective response than chemotherapy in a phase 3 study involving patients with ipilimumab-refractory metastatic melanoma. The use of nivolumab in previously untreated patients with advanced m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::5c65f062f652b655567ada085c338efb
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3110182
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3110182
Autor:
Antonino Scandurra, R. Tiziani, Angelo Cavallaro, L. Gobbato, C. Cognetti, Salvatore Pignataro
Publikováno v:
Surface and Interface Analysis. 38:429-432
The curing process of silver-filled glues can be traditionally monitored through thermomechanical measurements such as differential scanning calorimetry (DSC). This technique is useful for the control of the polymerization and other chemical reaction
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::19badca443fa38d5dd2c1c16a905425d
https://doi.org/10.1002/sia.2164
https://doi.org/10.1002/sia.2164
Autor:
A, Gubitosi, G, Moccia, F A, Malinconico, G, Iside, F, Gilio, C, Cognetti, F, Foroni, G, Docimo, R, Ruggiero, L, Docimo, M, Agresti
Publikováno v:
Il Giornale di chirurgia. 30(4)
Paget breast disease is a kind of intraductal carcinoma that through an intracanalicular diffusion invades the basal epidermal layer, reaching the areola and nipple, producing a typical erythematous desquamative eczematous-like lesion. This neoplasia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::82f014f6c4f5251afde4aa4d7a7ae52b
https://pubmed.ncbi.nlm.nih.gov/19419616
https://pubmed.ncbi.nlm.nih.gov/19419616
Autor:
C. Cognetti
Publikováno v:
ICECS
We are crossing the threshold of the third revolution in semiconductor packaging. In the psila80s, Surface Mount Technology (SMT) had major impact in size reduction of all electronic systems. In the psila90s the Ball Grid Array (BGA) package has been
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14601794c0979c36599001a3f3bbe866
https://doi.org/10.1109/icecs.2008.4675124
https://doi.org/10.1109/icecs.2008.4675124
Autor:
C. Cognetti
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Evolution of semiconductor packaging has taken impressive acceleration, under the pressure of new applications, combining very high volumes, innovation and cost effectiveness. Conventional single chip package completed its cycle, by reaching a die-to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d4b9f3a6c5bbda4207e242cdae70462
https://doi.org/10.1109/esime.2006.1644056
https://doi.org/10.1109/esime.2006.1644056
Publikováno v:
Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.
Thermal impedance and the main factors influencing it in plastic semiconductor packages are discussed. A test procedure is presented for measuring and quantifying the thermal characteristics of semiconductor packages. Using these test methods the the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6144831d9dc1ac6f19b6168b5b5c2dba
https://doi.org/10.1109/semthe.1988.10597
https://doi.org/10.1109/semthe.1988.10597
Autor:
D, Parmeggiani, F A, Malinconico, G, Moccia, D N, Idà, C, Ripa, R, Scala, F, Foroni, F, Gilio, C, Cognetti, G, Iside, M, Agresti
INTRODUCTION: The aim to individuate the eventual correlation between the two pathologies has justified deeper studies to achieve new prospective approaches for both disease. BACKGROUND: We have selected 4 groups of patients who presented an associat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid_dedup__::470a68c999ca4fd8df0860d902790b0f
http://hdl.handle.net/11591/188879
http://hdl.handle.net/11591/188879
Autor:
C. Cognetti
Publikováno v:
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
Interconnection technology of the first and second levels of electronic packaging is based on tin-lead alloys, which provide cheap and reliable solder joints. International regulations for environmental protection are addressing the elimination of le
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a28c0a0c6ecbd0066e5bfcd547ab268b
https://doi.org/10.1109/eptc.2000.906415
https://doi.org/10.1109/eptc.2000.906415