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Publikováno v:
Munibe Antropologia-Arkeologia, Vol 65, Pp 37-51 (2014)
Se presenta el estudio de conjunto de las representaciones paleolíticas de zoomorfos con la cabeza vuelta hacia atrás. Su análisis detallado permite enunciar algunas hipótesis de carácter tecnológico (orientación), cronológico y contextual (a
Externí odkaz:
https://doaj.org/article/9a1221075a6b4ac9b8589994001f25b2
Autor:
S. Vela-Bernal, E. Fuertes, P. Albiol, I. de la Morena, C. Bea, A. I. de Gracia, A. de Castro, L. Navarro, M. J. Forner
Publikováno v:
Annals of the Rheumatic Diseases. 81:1348.1-1348
BackgroundSince 2011, the use of Belimumab for the treatment of Systemic Lupus Erythematosus (SLE)has demonstrated efficacy and safety in several randomised clinical trials. However, strict inclusion criteria may restrict those results limiting the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::111860a75cec29e165aec8c26e80ec42
https://doi.org/10.1136/annrheumdis-2022-eular.3863
https://doi.org/10.1136/annrheumdis-2022-eular.3863
Publikováno v:
Malaysian Orthopaedic Journal, Vol 9, Iss 3, Pp 49-51 (2015)
Malaysian Orthopaedic Journal
Malaysian Orthopaedic Journal
Following a week after a jellyfish sting, a young man presented with regional cyanosis and threat of distal gangrene secondary to vascular spasm in the forearm. The patient also suffered from transient paresis and numbness of the affected upper limb.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b3ec0f47e54bf8ada75dae0aff6ae77b
http://www.morthoj.org/2015/v9n3/jellyfish-envenomation.pdf
http://www.morthoj.org/2015/v9n3/jellyfish-envenomation.pdf
Autor:
K-W Lee, J-C Bea, Takafumi Fukushima, Tetsu Tanaka, C. Nagai, Mitsumasa Koyanagi, R. Suresh, Xin Wu
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
In order to solve the critical issues of current standard chip-to-wafer (C2W)/wafer-to-wafer (W2W) hybrid bonding technologies, we propose novel reconfigured wafer-to-wafer (W2W) hybrid bonding technology using three types of scaled tiny electrodes w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03c1324fde8a5778839722e92dac64a6
https://doi.org/10.1109/iedm.2015.7409652
https://doi.org/10.1109/iedm.2015.7409652
Autor:
K-W Lee, Takafumi Fukushima, Y. Sato, C. Nagai, Mitsumasa Koyanagi, J-C Bea, Hideki Hashimoto, M. Murugesan, S. Konno, Tetsu Tanaka, M. Onishi
Publikováno v:
2014 IEEE International Electron Devices Meeting.
A highly dependable 3-D stacked multicore processor module composed of 4-layer stacked 3-D multicore processor chip and 2-layer stacked 3-D cache memory chip is implemented using reconfigured multichip-on-wafer 3-D integration and backside TSV techno
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b80f7e29df2dc4caf11ef6bd297aff6
https://doi.org/10.1109/iedm.2014.7047128
https://doi.org/10.1109/iedm.2014.7047128
Publikováno v:
Malaysian Orthopaedic Journal
Malaysian Orthopaedic Journal, Vol 7, Iss 3, Pp 18-20 (2013)
Malaysian Orthopaedic Journal, Vol 7, Iss 3, Pp 18-20 (2013)
Clavicle fracture is commonly treated conservatively. However uncommon complication can arise causing impingement. We report a patient who sustained distal clavicle fracture and was treated conservatively. However he developed persistent shoulder pai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b66fd91f7a361fc9b1cd2ea685be2ac
http://europepmc.org/articles/PMC4322137
http://europepmc.org/articles/PMC4322137
Autor:
V. García Bustos, Víctor Marcos-Garcés, C. Bea Serrano, P. Molina Aguilar, J. Benavent Seguí, Amparo Ruiz-Sauri, A. Ferrández Izquierdo
Publikováno v:
Journal of anatomy. 225(1)
The tissue organisation of dermal collagen is gaining importance as a contributing factor both in development and ageing, as well as in skin maturation processes. In this work we aim to study different representative parameters of this structural org
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5546956b0a16ce9e6704212e6d77b4a8
https://pubmed.ncbi.nlm.nih.gov/24754576
https://pubmed.ncbi.nlm.nih.gov/24754576
Autor:
K-W Lee, M. Murugesan, Tetsu Tanaka, Hideki Naganuma, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, J-C Bea
Publikováno v:
3DIC
The Young's modulus (E) of Si substrate begins to noticeably decrease below 50-μm thickness. The Young's modulus in 30-μm thick Si substrate decreased by approximately 30% compared to the modulus of 50-μm thickness. In 30-μm thick Si substrate, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d95f71bdb9294ab0fb88eccbae1e0cd
https://doi.org/10.1109/3dic.2013.6702336
https://doi.org/10.1109/3dic.2013.6702336
Autor:
Yoshikazu Ohara, J-C Bea, Takafumi Fukushima, Yutaka S. Sato, Mitsumasa Koyanagi, Hideki Hashimoto, S. Watanabe, K. Kiyoyama, S. Konno, M. Murugesan, K-W Lee, Tetsu Tanaka, T. Kamada, A. Yabata
Publikováno v:
2012 International Electron Devices Meeting.
We demonstrate the chip-based 3D heterogeneous integration technology for realizing highly parallel 3D-stacked image sensor. Three kinds of chips, CMOS image sensor chip, analog circuit chip, and ADC array chip, which were fabricated by different tec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0545ae3d8c1e5376e27b0679bb6d4c66
https://doi.org/10.1109/iedm.2012.6479156
https://doi.org/10.1109/iedm.2012.6479156