Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Byron Blackmore"'
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18435172a1ca8c6cf1363680b36aa431
https://doi.org/10.1109/therminic52472.2021.9626526
https://doi.org/10.1109/therminic52472.2021.9626526
Publikováno v:
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Product design now spans multiple organizations to a far greater extent than in the past, requiring aspects of the digital thread within model-based enterprises, to connect from their suppliers to their customers, to deliver additional business value
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a67078062c761c93b08dbce47b7467ac
https://doi.org/10.1109/therminic.2018.8593319
https://doi.org/10.1109/therminic.2018.8593319
Publikováno v:
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Imposing a step change in power dissipation to a packaged semiconductor and measurement of the resulting thermal response of a temperature sensitive parameter in time is a well-established testing method. This thermal response can be processed so as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05abaa38b27b4664802455377c539fda
https://doi.org/10.1109/semi-therm.2018.8357361
https://doi.org/10.1109/semi-therm.2018.8357361
Publikováno v:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Classical approaches to the 3D thermal simulation of electronic systems require assumptions regarding the amount of power dissipated and its distribution. Errors in such assumptions are a leading cause of resulting errors in temperature rise predicti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff3dec8231216041884ad0b8bfaa18a
https://doi.org/10.1109/semi-therm.2017.7896904
https://doi.org/10.1109/semi-therm.2017.7896904
Autor:
Byron Blackmore
Publikováno v:
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Structure function based simulation model calibration has become common in the electronics cooling industry. Verifying that a model can produce a simulated structure function curve that matches an experimental structure function is valuable to the an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::101f89aa4e4e95b7aadd0a5a8019d88d
https://doi.org/10.1109/semi-therm.2016.7458454
https://doi.org/10.1109/semi-therm.2016.7458454
Autor:
Byron Blackmore, John Parry
Publikováno v:
20th International Workshop on Thermal Investigations of ICs and Systems.
The generation of Compact Thermal Models (CTMs) for electronics packages with simulation tools has long been a task for thermal engineers. One of the challenges traditionally associated with this task is the engineering effort required to reliably cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d65205387a4d079c68ee2174f568c3cf
https://doi.org/10.1109/therminic.2014.6972490
https://doi.org/10.1109/therminic.2014.6972490
Publikováno v:
Journal of Colloid and Interface Science. 241:514-520
This paper reports an experimental study of the detachment of air bubbles adhered to both upper and lower surfaces of a slit microchannel by shearing flow. The liquid used in the experiments was a base engine oil (MCT-30, Imperial Oil). Microchannels
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ddaec23d91430a09854c0a2652592b05
https://doi.org/10.1006/jcis.2001.7755
https://doi.org/10.1006/jcis.2001.7755
Publikováno v:
Colloids and Surfaces A: Physicochemical and Engineering Aspects. 182:109-122
This paper extends the overall energy balance (OEB) approach to the modeling of liquid drop spreading to cases where the primary motive force is hydrodynamic in nature. In such cases the mass, and therefore total energy, of the system varies with tim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::460091000d99ec996d66d4f8c502c0d2
https://doi.org/10.1016/s0927-7757(00)00834-7
https://doi.org/10.1016/s0927-7757(00)00834-7
Publikováno v:
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
Calculation and display of a ther mal ‘ShortCut’ scalar field as an integrated part of a CFD simulation enables a practitioner to visualize and understand the physical mechanisms by which heat is removed from an electronics system and where oppor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c4e87a1f7317b559939355f2bf2411d
https://doi.org/10.1109/stherm.2012.6188849
https://doi.org/10.1109/stherm.2012.6188849
Publikováno v:
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Calculation and display of a thermal bottleneck scalar field as an integrated part of a CFD simulation enables a practitioner to interact with and understand the physical mechanisms by which heat is removed from an electronics system. By applying the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce4a09ea9829c66905f8b4239fc21477
https://doi.org/10.1109/stherm.2011.5767181
https://doi.org/10.1109/stherm.2011.5767181