Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Byoung-Jun Cho"'
Autor:
Heon-Yul Ryu, Yutaka Wada, Nagendra Prasad Yerriboina, Chan-Hee Lee, Jun-Kil Hwang, Jin-Goo Park, Hirokuni Hiyama, Byoung-Jun Cho, Satomi Hamada
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P3058-P3062
This research was supported by Ansan-Si hidden champion fostering and supporting project funded by Ansan city.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::492ecd830b135664fdac00692c448cb9
https://doi.org/10.1149/2.0101905jss
https://doi.org/10.1149/2.0101905jss
Publikováno v:
Tribology International. 120:203-209
In this study, a sapphire lapping plate was fabricated using a unique blend of copper (Cu) metal particles and resin to overcome the drawbacks of traditional iron (Fe) and Cu plate lapping. An optimum Cu-resin ratio was found by evaluating the MRR, s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3eff16c4781e932dd837b6117e0932a5
https://doi.org/10.1016/j.triboint.2017.12.037
https://doi.org/10.1016/j.triboint.2017.12.037
Publikováno v:
Applied Surface Science. 384:505-510
The effect of Cu surface conditions on Cu-BTA complex formation was investigated using contact angle, electrochemical impedance spectroscopy, spectroscopic ellipsometry and XPS measurements which is of interest to Cu Chemical Mechanical Planarization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06bc9593c10608774b0d20896a947198
https://doi.org/10.1016/j.apsusc.2016.05.106
https://doi.org/10.1016/j.apsusc.2016.05.106
Autor:
Jin-Yong Kim, Byoung-Jun Cho, Min-Su Kim, Gun-Ho Park, Hyun-Tae Kim, Jung-Hwan Lee, Jin-Goo Park
Publikováno v:
ECS Transactions. 69:69-75
The RCA cleaning process is a standard wet cleaning process for removal of contaminants from silicon wafer surface. As well known, the SC1 cleaning solution which consists of a mixture of NH4OH (ammonium hydroxide), H2O2 (hydrogen peroxide) and H2O i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::844bcd9bc21ce7deb6f07bb2ea629251
https://doi.org/10.1149/06908.0069ecst
https://doi.org/10.1149/06908.0069ecst
Publikováno v:
Wear. :794-799
Lapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal–resin platen was tested. The metal–resin platen was produced by mixing metal particle
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64b838785d5d7505511c61c406111afb
https://doi.org/10.1016/j.wear.2015.02.029
https://doi.org/10.1016/j.wear.2015.02.029
Publikováno v:
Solid State Phenomena. 219:205-208
Although copper have better electrical properties than aluminum such as low resistivity and high electro-migration resistivity, aluminum has been used as an interconnect material due to the difficulty in Cu dry etching. Since CMP process has been ada
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c17764a2848ade0fdfdf8283d7c76ee1
https://doi.org/10.4028/www.scientific.net/ssp.219.205
https://doi.org/10.4028/www.scientific.net/ssp.219.205
Publikováno v:
Microelectronic Engineering. 122:33-39
Copper surfaces can become contaminated by slurry particles and organic residues during chemical mechanical planarization (CMP). Silica particles are widely used as abrasives, while benzotriazole (BTA) is widely used as corrosion inhibitor, in copper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c29585e8de0c3d9d3dc0e9dfd8306380
https://doi.org/10.1016/j.mee.2014.02.034
https://doi.org/10.1016/j.mee.2014.02.034
Autor:
Chang-ki Hong, R. Prasanna Venktesh, Hyuk-Min Kim, Jin-Goo Park, Byoung-Jun Cho, Tae-Young Kwon, Manivannan Ramachandran
Publikováno v:
Tribology Transactions. 57:190-197
In the silicon dioxide chemical–mechanical polishing (CMP) process, one of the most challenging issues is the formation of defects such as scratches. In this study, scratch formation behavior and CMP performance were evaluated on high-density plasm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::841840428b32df13f8989ff40b43f56a
https://doi.org/10.1080/10402004.2013.861048
https://doi.org/10.1080/10402004.2013.861048
Publikováno v:
Tribology International. 67:272-277
The effects of pad surface roughness and debris induced by various types of diamond conditioners during the chemical mechanical planarization (CMP) process and their scratch forming behaviors were evaluated. Five types of conditioners having differen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a00851b0338d0b43b30ed2f63a727f05
https://doi.org/10.1016/j.triboint.2013.08.008
https://doi.org/10.1016/j.triboint.2013.08.008
Publikováno v:
Wear. 302:1334-1339
Glass ceramics are one of the important materials for optoelectronic devices. Fixed abrasive, double-sided lapping parameters (time, pressure, and platen speed) were optimized using borofloat, BK7 and quartz substrates. Lapping of borofloat, BK7 and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ad709bfbf373321175f437c62ad9347
https://doi.org/10.1016/j.wear.2012.11.024
https://doi.org/10.1016/j.wear.2012.11.024