Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Byeong-Uk Hwang"'
Publikováno v:
Journal of Electronic Materials. 50:5639-5646
In the 3D integrated circuit package industry, the remelting of solder joints during repeated stacking processes can cause electrical failure and low bonding strength. Transient liquid phase sintering (TLPS) bonding based on forming full intermetalli
Publikováno v:
Journal of Materials Science: Materials in Electronics. 32:3054-3065
Cu sintering bonding has been considered a promising interconnection method for high-temperature applications like power electronics because of the low cost, low electrical resistivity, and high heat endurance of copper. However, Cu sintering bonding
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:22926-22932
The mass reflow (MR) process is widely used in electronic packaging interconnection. However, the conventional MR process can cause thermal damage to components and requires a long process time. The laser-assisted bonding (LAB) process is considered
Publikováno v:
Journal of Electronic Materials. 49:6746-6753
Ni decorated multi-walled carbon nanotube (Ni-MWCNT) composite solders have been fabricated using Ni-MWCNT composite materials and Sn58Bi solder alloys. Ni-MWCNT composite materials were synthesized with functionalization, reduction and electroless p
Publikováno v:
Electronic Materials Letters. 16:347-354
Transient liquid phase sintering (TLPS), which is a combined bonding technology of sintering and transient liquid phase bonding, is considered to be a promising sic. die attach material owing to its excellent mechanical properties and low cost. To pr
Publikováno v:
Electronic Materials Letters. 16:332-339
The multifunctional properties of cross-liked carboxymethlycellulose (CMC) and polyethyleneimine (PEI) films with varied CMC:PEI ratios and Ag flake sizes were studied. Both the CMC and PEI were cross-linked through a sonication process to achieve di
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:3035-3041
Cu nanopaste is a candidate to replace Ag nanopaste, but the oxidation problems associated with Cu nanopaste must be overcome. In this study, we fabricated Cu nanopaste with various contents of sodium dodecylbenzene sulfonate (SDBS), and the oxidatio
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Electronic packaging has been miniaturized for high density and performance. Therefore, the formation of reliable interconnections has become an important issue. However, the conventional reflow process depends on a high process temperature and long
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Mass reflow (MR) has been widely used in the interconnecting process of electronic packaging. However, use of conventional MR shows a limitation in the miniaturization trend of electronic devices because of thermal damage to heat- sensitive polymer c
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Transient liquid phase sintering (TLPS) bonding has been widely researched for high temperature interconnection. At TLPS bonding, intermetallic compounds (IMCs) form by solid-liquid interdiffusion between molten low–melting point (MP) metals and hi