Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Byeoncheol Lee"'
Autor:
Hyungseup Kim, Byeoncheol Lee, Yeongjin Mun, Jaesung Kim, Kwonsang Han, Youngtaek Roh, Dongkyu Song, Seounghoon Huh, Hyoungho Ko
Publikováno v:
Micromachines, Vol 9, Iss 7, p 347 (2018)
This paper proposes a reconfigurable sensor analog front-end using low-noise chopper-stabilized delta-sigma capacitance-to-digital converter (CDC) for capacitive microsensors. The proposed reconfigurable sensor analog front-end can drive both capacit
Externí odkaz:
https://doaj.org/article/629437d14d2149a48456067122cb8e7d
Autor:
Byeoncheol Lee, Ji-Hoon Kim, Hyoungho Ko, Dong Kyue Kim, Kwonsang Han, Byong-Deok Choi, Jaesung Kim, Hyungseup Kim, Yeongjin Mun
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 19:260-269
Invasive physical attacks on integrated circuits (ICs), such as de-packaging, focused ion beam (FIB) chip editing, and micro-probing attempts, constitute security threats for chips with potentially valuable information, such as smart cards. Using a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc0d33be0b14ffe3abe3b2ec7522d2bc
https://doi.org/10.5573/jsts.2019.19.3.260
https://doi.org/10.5573/jsts.2019.19.3.260
Publikováno v:
Microsystem Technologies. 25:2093-2098
In this paper, a low-power 12-bit successive approximation register (SAR) resistance-to-digital converter (RDC) for resistive microsensors with a figure-of-merit (FoM) of 33 pJ/conversion-step is presented. In the conventional resistive analog front-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19275ab4b534646bbc12649c331d1bff
https://doi.org/10.1007/s00542-018-4229-z
https://doi.org/10.1007/s00542-018-4229-z
Autor:
Byong-Deok Choi, Ji-Hoon Kim, Byeoncheol Lee, Dong Kyue Kim, Youngwoon Ko, Hyungseup Kim, Hyoungho Ko, Yeongjin Mun
Publikováno v:
Computers & Electrical Engineering. 70:74-82
This study presents an optical secure circuit for physical attack protection. On-chip photodiodes are integrated for optical energy harvesting to operate the optical secure circuit in a standard CMOS process. The aim of the proposed optical secure ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f91c3acd6660c02d4ad6eee412dc006c
https://doi.org/10.1016/j.compeleceng.2018.06.005
https://doi.org/10.1016/j.compeleceng.2018.06.005
Autor:
Byeoncheol Lee, Yeongjin Mun, Youngwoon Ko, Hyoungho Ko, Yi-Gyeong Kim, Hyungseup Kim, Hyunjoong Lee
Publikováno v:
Microsystem Technologies. 25:2041-2050
In this paper, a low-phase-noise self-sustaining amplifier IC with parallel capacitance cancellation for low-Q piezoelectric resonator is presented. The target of the proposed low-phase-noise self-sustaining amplifier IC is a mass-sensitive oscillato
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7f4c9c988a674422ed53541d5cf0559
https://doi.org/10.1007/s00542-018-3830-5
https://doi.org/10.1007/s00542-018-3830-5
Publikováno v:
Microsystem Technologies. 25:2035-2040
This paper proposes a 164 nW inverter-based capacitive readout integrated circuit (IC) for a microaccelerometer. The designed circuit is implemented using a two-stage inverter-based fully differential current-reuse amplifier to achieve ultra-low powe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5753baa71787649f0d4abcee251ac71b
https://doi.org/10.1007/s00542-018-3707-7
https://doi.org/10.1007/s00542-018-3707-7
Autor:
Dongkyu Song, Hyoungho Ko, Hyungseup Kim, Seounghoon Huh, Jaesung Kim, Youngtaek Roh, Kwonsang Han, Byeoncheol Lee, Yeongjin Mun
Publikováno v:
Micromachines
Micromachines, Vol 9, Iss 7, p 347 (2018)
Volume 9
Issue 7
Micromachines, Vol 9, Iss 7, p 347 (2018)
Volume 9
Issue 7
This paper proposes a reconfigurable sensor analog front-end using low-noise chopper-stabilized delta-sigma capacitance-to-digital converter (CDC) for capacitive microsensors. The proposed reconfigurable sensor analog front-end can drive both capacit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c00df5fd37db0c20cf0caff249be89c9
http://europepmc.org/articles/PMC6082274
http://europepmc.org/articles/PMC6082274
Publikováno v:
Sensors and Materials. 31:1697
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ebaf955738d8ec8365b841a599e41b3
https://doi.org/10.18494/sam.2019.2330
https://doi.org/10.18494/sam.2019.2330
Autor:
Kwonsang Han, Sangyoun Shin, Woo Suk Sul, Boung Ju Lee, Gyungtae Kim, Byeoncheol Lee, Hyungseup Kim, Jaesung Kim, Hyoungho Ko, Sangmin Lee
Publikováno v:
Sensors and Materials. 31:1523
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::709f0317e648789e0ff048365947eb8c
https://doi.org/10.18494/sam.2019.2272
https://doi.org/10.18494/sam.2019.2272
Autor:
Jaesung Kim, Dong Kyue Kim, Byeoncheol Lee, Hyungseup Kim, Byong-Deok Choi, Hyoungho Ko, Kwonsang Han, Ji-Hoon Kim
Publikováno v:
Sensors and Materials. 31:1375
This work was supported by the Samsung Research Funding Center of Samsung Electronics under Project Number SRFC-IT1601-01. The chip fabrication and EDA tool were supported by the IC Design Education Center (IDEC), Republic of Korea.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4b02520037c5608bc87b48b99b67716
https://doi.org/10.18494/sam.2019.2258
https://doi.org/10.18494/sam.2019.2258