Zobrazeno 1 - 10
of 1 264
pro vyhledávání: '"Butun S"'
Autor:
Liu R; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Janicki TD; Department of Chemistry, University of Wisconsin-Madison, Madison, WI 53706, USA., Marks SD; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Gyan DS; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Zuo P; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Savage DE; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Zhou T; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439, USA., Cai Z; Advanced Photon Source, Argonne National Laboratory, Lemont, IL 60439, USA., Holt M; Center for Nanoscale Materials, Argonne National Laboratory, Lemont, IL 60439, USA., Butun S; Northwestern University Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL 60208, USA., Lu S; Northwestern University Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL 60208, USA., Basit N; Northwestern University Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL 60208, USA., Hu X; Northwestern University Atomic and Nanoscale Characterization Experimental Center, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA., Abbott T; Northwestern University Atomic and Nanoscale Characterization Experimental Center, Northwestern University, Evanston, IL 60208, USA., Kabat N; Northwestern University Atomic and Nanoscale Characterization Experimental Center, Northwestern University, Evanston, IL 60208, USA., Li W; State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China., Li Q; State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China., Kelley KP; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Vasudevan RK; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, TN 37831, USA., Schmidt JR; Department of Chemistry, University of Wisconsin-Madison, Madison, WI 53706, USA., Babcock SE; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA., Evans PG; Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA.
Publikováno v:
Science advances [Sci Adv] 2024 Jul 26; Vol. 10 (30), pp. eadk5509. Date of Electronic Publication: 2024 Jul 24.
Akademický článek
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Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Klepov VV; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.; Department of Chemistry, University of Georgia, Athens, Georgia 30602, United States., De Siena MC; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States., Pandey IR; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.; Materials Science Division, Argonne National Laboratory, Lemont, Illinois 60439, United States., Pan L; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States., Bayikadi KS; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States., Butun S; NUFAB, Northwestern University, Evanston, Illinois 60208, United States., Chung DY; Materials Science Division, Argonne National Laboratory, Lemont, Illinois 60439, United States., Kanatzidis MG; Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.; Materials Science Division, Argonne National Laboratory, Lemont, Illinois 60439, United States.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2023 Apr 05; Vol. 15 (13), pp. 16895-16901. Date of Electronic Publication: 2023 Mar 24.
Autor:
Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Hu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Seo MH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; School of Biomedical Convergence Engineering, College of Information & Biomedical Engineering, Pusan National University, Pusan, 46241, Republic of Korea., Xu Y; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, 63130, USA., Yan Y; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Hsu YH; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Berkovich J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Lee K; Department of Biological Sciences, Northwestern University, Evanston, IL, 60208, USA., Liu TL; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., McDonald S; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Nie H; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Oh H; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Wu M; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Kim JT; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Miller SA; Laser and Electronics Design Core Facility, Northwestern University, Evanston, IL, 60208, USA., Jia Y; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Butun S; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Bai W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, 27599, USA., Guo H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Choi J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Banks A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Ray WZ; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Kozorovitskiy Y; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA.; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA., Becker ML; Department of Chemistry, Duke University, Durham, NC, 27708, USA.; Department of Biomedical Engineering and Orthopaedic Surgery, Duke University, Durham, NC, 27708, USA., Pet MA; Division of Plastic and Reconstructive Surgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., MacEwan MR; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Chang JK; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Wearifi Inc., Evanston, IL, 60201, USA., Wang H; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. helingwang1@gmail.com.; Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. helingwang1@gmail.com.; Zhejiang Tsinghua Institute of Flexible Electronics Technology, Jiaxing, 314000, China. helingwang1@gmail.com., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.
Publikováno v:
Nature communications [Nat Commun] 2022 Oct 31; Vol. 13 (1), pp. 6518. Date of Electronic Publication: 2022 Oct 31.
Publikováno v:
Sigma: Journal of Engineering & Natural Sciences / Mühendislik ve Fen Bilimleri Dergisi. Oct2024, Vol. 42 Issue 5, p1511-1518. 8p.
Autor:
Kilicaslan OF; Antalya Education and Research Hospital, Department of Orthopaedics and Traumatology, Antalya, Turkey., Tokgoz MA, Butun S, Nabi V, Akalin S
Publikováno v:
Turkish neurosurgery [Turk Neurosurg] 2021; Vol. 31 (5), pp. 795-802.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Mao, Jinxian1 (AUTHOR) mjx13621805747@shu.edu.cn, Yang, Fengyuan1,2 (AUTHOR) wangqianyi@shu.edu.cn, Wang, Qian1 (AUTHOR) chen_yuzi@shu.edu.cn, Chen, Yuzi1 (AUTHOR), Wang, Nan1,2 (AUTHOR) yang_fengyuan@shu.edu.cn
Publikováno v:
Sensors (14248220). Jul2024, Vol. 24 Issue 14, p4548. 14p.
Autor:
Kwak, Hojae1 (AUTHOR), Jung, Incheol1 (AUTHOR), Kim, Dohyun1 (AUTHOR), Ju, Seongcheol1 (AUTHOR), Choi, Soyoung1 (AUTHOR), Kang, Cheolhun1 (AUTHOR), Kim, Hyeonwoo1 (AUTHOR), Baac, Hyoung Won2 (AUTHOR) hwbaac@skku.edu, Ok, Jong G.3 (AUTHOR) jgok@seoultech.ac.kr, Lee, Kyu-Tae1 (AUTHOR) ktlee@inha.ac.kr
Publikováno v:
Scientific Reports. 6/13/2024, Vol. 14 Issue 1, p1-9. 9p.