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Autor:
Buschbeck, Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy
Publikováno v:
Micromachines; Volume 14; Issue 7; Pages: 1365
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air.