Zobrazeno 1 - 10
of 57
pro vyhledávání: '"BumHee Bae"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 64:429-442
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c374eba415415b9d19675540c7d54654
https://doi.org/10.1109/temc.2021.3134913
https://doi.org/10.1109/temc.2021.3134913
Autor:
Jongwan Shim, SoYoung Kim, Youngbong Han, KwangMo Yang, TaeWoong Kim, Hung Khac Le, BumHee Bae
Publikováno v:
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE. 21:311-321
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b2ec8b1b5d0c9c342069eb900bd1c35
https://doi.org/10.5573/jsts.2021.21.5.311
https://doi.org/10.5573/jsts.2021.21.5.311
Autor:
Bumhee Bae, Kwangmo Yang, Younho Kim, Minseok Kim, Younghun Seong, Jaehoon Lee, Jeongnam Cheon
Publikováno v:
Electronics; Volume 11; Issue 19; Pages: 3209
Recently, new form factors, such as foldable, have increased demand for mobile products.Moreover, mobile phones should support the RF signal frequency up to the mm-wave frequencydue to the expansion of 5G mobile products. Therefore, 5G foldable produ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9ccdb7f33342eb9248feb5565ed0a76b
Publikováno v:
Electronics; Volume 11; Issue 19; Pages: 2995
For high-speed communication services such as 5G technology, the use of millimeter-wave (mmWave) components substantially increases in mobile applications. The interconnect based on a substrate-integrated waveguide (SIW) is an efficient solution for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::67f63c01bd5f85e0b5e07c2c34f2b0f4
https://doi.org/10.3390/electronics11192995
https://doi.org/10.3390/electronics11192995
Autor:
Kyungjune Son, Michael Bae, Hyesoo Kim, Kyungjun Cho, Dongho Ha, Subin Kim, Junyong Park, Joungho Kim, Seongsoo Lee, Jonghoon J. Kim, Bumhee Bae, Dong-Hyun Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:2152-2162
This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket for high-bandwidth and high-density package test using a fabricated sample. In addition, this paper also characterizes and verifies the coaxial silicone rubber
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea728eb21bb74385c0b3a90291c1940e
https://doi.org/10.1109/tcpmt.2018.2828223
https://doi.org/10.1109/tcpmt.2018.2828223
Autor:
Soonyong Lee, Bumhee Bae, Woncheol Song, Chulsoon Hwang, Junho Joo, Hoyong Kim, Youngkun Kwon
Publikováno v:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
In this paper, a dielectric properties extraction method for millimeter-wave applications is presented. Substrate integrated waveguide (SIW) cavity resonators with the same structure and varied thicknesses are employed to separate the dissipation fac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a99462a4eee9e67cd5d2f7182c8d5b83
https://doi.org/10.1109/emcsi38923.2020.9191628
https://doi.org/10.1109/emcsi38923.2020.9191628
Autor:
Bumhee Bae, Sumin Choi, Huijin Song, Youngwoo Kim, Junyong Park, Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Jonghoon Kim, Joungho Kim, Manho Lee, Seongsoo Lee
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:1510-1519
This paper, for the first time, proposes a novel stochastic model-based eye-diagram estimation method for 8B/10B and transition-minimized differential signaling (TMDS)-encoded high-speed channels. A stochastic model describes a behavior of an encoder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77af73c8696b3b6a3ba8a5e489ec4d9b
https://doi.org/10.1109/temc.2017.2766295
https://doi.org/10.1109/temc.2017.2766295
Autor:
Victor Khilkevich, Jun Fan, Giorgi Maghlakelidze, Chulsoon Hwang, Bumhee Bae, Li Guan, Shubhankar Marathe, Xin Yan, David Pommerenke, Qiaolei Huang
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:1087-1094
In a near-field scanning system, each element of the measurement chain contributes to the thermal noise power density: probe, cables, amplifiers, and the measuring instrument. The signal-to-noise ratio (SNR) is strongly affected by the source output
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::386fa74efa50a2f5af80f8ee3f8b2f2f
https://doi.org/10.1109/temc.2018.2792778
https://doi.org/10.1109/temc.2018.2792778
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 60:1121-1128
A method of moment (MoM)-based current reconstruction method is proposed to estimate the surface current density on the ground plane. Current continuity property is automatically enforced with Rao–Wilton–Glisson basis function. Both the least squ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1890fe9d2fefe8b0722cacd992fedc7b
https://doi.org/10.1109/temc.2018.2791539
https://doi.org/10.1109/temc.2018.2791539
Autor:
Shinyoung Park, Dongho Ha, Joungho Kim, Michael Bae, Junyong Park, Hyesoo Kim, Bumhee Bae, Sumin Choi, Jonghoon Kim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1356-1368
As a demand for electrical systems with a wide data bandwidth has increased, high-performance packages ensuring high data rates, such as low power double data rate series, have become common. The need for high-performance test sockets has also emerge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07c42de2c1c3f1c086e29adc254c5a24
https://doi.org/10.1109/tcpmt.2017.2712362
https://doi.org/10.1109/tcpmt.2017.2712362