Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Budy D. Notohardjono"'
Publikováno v:
Volume 8: Seismic Engineering.
Shorter development design schedules and increasingly dense product designs create difficult challenges in predicting structural performance of a mainframe computer’s structure. To meet certain certification benchmarks such as the Telcordia Technol
Autor:
Budy D. Notohardjono, John G. Torok, Khambati Suraush, Shawn Canfield, Robert K. Mullady, Jing Zhang
Publikováno v:
International Symposium on Microelectronics. 2015:000169-000178
Recent high-end server designs have included new Input / Output (I/O) printed circuit board (PCB) assemblies consisting of a variety of form factors, electronic design layouts, and packaging assembly characteristics. To insure the required functional
Publikováno v:
Volume 8: Seismic Engineering.
A typical mainframe computer rack is narrow, tall and long. In certain installations, during its functional operation, the server can be subjected to earthquake events. The rack is a steel structure joined together with steel rivets. One of the rack
Publikováno v:
Volume 8: Seismic Engineering.
A mainframe computer’s structure consists of a frame or rack, drawers with central processor units, IO equipment, memory and other electronic equipment. The focus of this structural mechanical analysis and design is on the frame, earthquake stiffen
Publikováno v:
Journal of Pressure Vessel Technology. 126:66-74
This paper presents the design features of an electrical equipment frame structure that can withstand a severe earthquake test profile. Original designs of these structures were optimized to survive shock and shipping vibrations only, since the major
Autor:
Prabjit Singh, Edward J. Seminaro, J. H. Quick, Joseph P. Corrado, Wiren D. Becker, Budy D. Notohardjono, Gary F. Goth, C. Wu, M. A. Nobile, Steven J. Ahladas, Frank E. Bosco, Sushumna Iruvanti, K. M. Soohoo
Publikováno v:
IBM Journal of Research and Development. 46:711-738
This paper provides an overview of the power, packaging, and cooling aspects of the IBM eServer z900 design. The semiconductor processor chips must be supported and protected in a mechanical structure that has to provide electrical interconnects whil
Autor:
Roger R. Schmidt, Budy D. Notohardjono
Publikováno v:
IBM Journal of Research and Development. 46:739-751
The IBM S/390® G4 CMOS system, first shipped in 1997, was the first high-end system to use refrigeration. The decision to employ refrigeration cooling instead of other cooling options such as high-flow air cooling or various water-cooling schemes
Publikováno v:
Volume 3: Engineering Systems; Heat Transfer and Thermal Engineering; Materials and Tribology; Mechatronics; Robotics.
This paper discusses the static and dynamic stability analysis of rack or frame computer/server products during shipping and relocation. The static stability is the ability of server products to resist tipping over on a typical raised floor in a data
Publikováno v:
IBM Journal of Research and Development. 45:771-782
Adequate retention of computer systems during earthquake events is important because it can not only prevent human injury and potential system damage, but also ensure system availability by limiting to acceptable levels the transmitted accelerations
Publikováno v:
Volume 8: Seismic Engineering.
This paper describes the finite element modeling of a mainframe server frame. The frame consists of a server rack or frame with its add-on stiffening brackets. The frame is anchored directly to the floor with bolts at each of the four corners. The Te